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Date:	Sun, 4 Mar 2012 21:21:57 -0800 (PST)
From:	merez@...eaurora.org
To:	"Saugata Das" <saugata.das@...aro.org>
Cc:	merez@...eaurora.org, "Namjae Jeon" <linkinjeon@...il.com>,
	"Seungwon Jeon" <tgih.jun@...sung.com>, linux-mmc@...r.kernel.org,
	"Chris Ball" <cjb@...top.org>, linux-kernel@...r.kernel.org
Subject: Re: [PATCH v5 2/2] mmc: core: Support packed command for eMMC4.5 
     device

> Hi Merez
>
> On 2 March 2012 19:56,  <merez@...eaurora.org> wrote:
>> Hi,
>>
>> Our tests showed that the write packing improved the performance of the
>> write sequential operations:
>>
>> Long write operation:
>> ----------------------
>> no-packing: 15.8 MB/s
>> packed commands patch (both READ and WRITE packing are enabled): 23.3
>> MB/s
>>
>> Several parallel write operations (sum of all the write throughputs):
>> ---------------------------
>> no-packing: 17.1 MB/s
>> packed commands patch(both READ and WRITE packing are enabled): 25 MB/s
>>
>> Parallel long read and long write operations (write throughput):
>> -----------------------------------------------------------------
>> no-packing: 12.2 MB/s
>> packed commands patch (both READ and WRITE packing are enabled): 16.3
>> MB/s
>>
>> Parallel short read and long write operations (write throughput):
>> -----------------------------------------------------------------
>> no-packing: 15.4 MB/s
>> packed commands patch (both READ and WRITE packing are enabled): 16.4
>> MB/s
>>
>> Several Parallel short read and short write operations (sum of all the
>> write throughputs):
>> --------------------------------------------------------------------------
>> no-packing: 12.5 MB/s
>> packed commands patch (both READ and WRITE packing are enabled): 15.5
>> MB/s
>>
>
> How did you perform the above tests ?
The sequential tests were performed with the lmdd application.
Thanks,
Maya Erez
Consultant for Qualcomm Innovation Center, Inc.
Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum


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