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Date:	Fri, 9 Aug 2013 16:32:13 +0300
From:	Felipe Balbi <balbi@...com>
To:	"Ivan T. Ivanov" <iivanov@...sol.com>
CC:	<balbi@...com>, <rob.herring@...xeda.com>, <pawel.moll@....com>,
	<mark.rutland@....com>, <swarren@...dotorg.org>,
	<ian.campbell@...rix.com>, <rob@...dley.net>,
	<gregkh@...uxfoundation.org>, <grant.likely@...aro.org>,
	<idos@...eaurora.org>, <mgautam@...eaurora.org>,
	<devicetree@...r.kernel.org>, <linux-doc@...r.kernel.org>,
	<linux-kernel@...r.kernel.org>, <linux-usb@...r.kernel.org>,
	<linux-omap@...r.kernel.org>, <linux-arm-msm@...r.kernel.org>
Subject: Re: [RFC PATCH v2 3/3] usb: dwc3: Add Qualcomm DWC3 glue layer driver

On Fri, Aug 09, 2013 at 12:53:47PM +0300, Ivan T. Ivanov wrote:
> From: "Ivan T. Ivanov" <iivanov@...sol.com>
> 
> DWC3 glue layer is hardware layer around Synopsys DesignWare
> USB3 core. Its purpose is to supply Synopsys IP with required
> clocks, voltages and interface it with the rest of the SoC.
> 
> Signed-off-by: Ivan T. Ivanov <iivanov@...sol.com>

same comments from previous version.

-- 
balbi

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