linux-kernel - Re: [PATCHv4 00/18] device thermal limits represented in device tree nodes (v4)

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Date:	Thu, 26 Sep 2013 23:15:02 -0400
From:	Eduardo Valentin <eduardo.valentin@...com>
To:	Eduardo Valentin <eduardo.valentin@...com>
CC:	<swarren@...dotorg.org>, <pawel.moll@....com>,
	<mark.rutland@....com>, <ian.campbell@...rix.com>,
	<rob.herring@...xeda.com>, <linux@...ck-us.net>,
	<rui.zhang@...el.com>, <wni@...dia.com>, <grant.likely@...aro.org>,
	<durgadoss.r@...el.com>, <linux-pm@...r.kernel.org>,
	<devicetree@...r.kernel.org>, <lm-sensors@...sensors.org>,
	<linux-kernel@...r.kernel.org>
Subject: Re: [PATCHv4 00/18] device thermal limits represented in device tree
 nodes (v4)

On 26-09-2013 23:13, Eduardo Valentin wrote:
> Hello all,
> 
> Here is the continuation of work of representing hardware thermal properties
> in device tree infrastructure. The present patch series is the fourth version
> of this work. Previous versions were sent as RFCs and can be found here:
> V3: 

Too fast, hit send too early. For those interested, here is the link to V3:
https://lkml.org/lkml/2013/9/15/122

> RFCv2: http://lkml.org/lkml/2013/8/23/594
> RFCv1: http://lkml.org/lkml/2013/7/22/319
> 
> Major difference from V3 is on the parser itself. I have updated the binding
> documentation and improved the code accordingly to previous comments mainly
> from Mark R. and Joe P.
> 
> The changes on hwmon drivers have been accepted by Guenter, and in this
> series I am including his Acked-by, as I didn't change anything on that side.
> 
> I also found a bug while using all involved code built as modules, thus
> I have reworked a bit the cooling device registration part. This is why
> there are two new patches in this series (patches 02 and 04).
> 
> Tests were done, just like in V3, on TI OMAP4430, OMAP4460, OMAP5430 and DRA7,
> although this series is not including the DRA7 part (I will be sending separately).
> 
> Thanks all who have been contributing reviewing this code.
> 
> All best,
> 
> Eduardo Valentin (18):
>   thermal: allow registering without .get_temp
>   thermal: core: allow binding via .bind when tzp is present
>   thermal: introduce device tree parser
>   thermal: core: introduce thermal_of_cooling_device_register
>   thermal: cpu_cooling: introduce of_cpufreq_cooling_register
>   cpufreq: cpufreq-cpu0: add dt node parsing for cooling device
>     properties
>   hwmon: lm75: expose to thermal fw via DT nodes
>   hwmon: tmp102: expose to thermal fw via DT nodes
>   thermal: ti-soc-thermal: use thermal DT infrastructure
>   arm: dts: add omap4 CPU thermal data
>   arm: dts: add omap4430 thermal data
>   arm: dts: add omap4460 thermal data
>   arm: dts: add cooling properties on omap4430 cpu node
>   arm: dts: add cooling properties on omap4460 cpu node
>   arm: dts: add omap5 GPU thermal data
>   arm: dts: add omap5 CORE thermal data
>   arm: dts: add omap5 thermal data
>   arm: dts: add cooling properties on omap5 cpu node
> 
>  .../devicetree/bindings/cpufreq/cpufreq-cpu0.txt   |   7 +
>  .../devicetree/bindings/thermal/thermal.txt        | 537 +++++++++++++
>  arch/arm/boot/dts/omap4-cpu-thermal.dtsi           |  41 +
>  arch/arm/boot/dts/omap443x.dtsi                    |  15 +-
>  arch/arm/boot/dts/omap4460.dtsi                    |  15 +-
>  arch/arm/boot/dts/omap5-core-thermal.dtsi          |  28 +
>  arch/arm/boot/dts/omap5-gpu-thermal.dtsi           |  28 +
>  arch/arm/boot/dts/omap5.dtsi                       |  15 +-
>  drivers/cpufreq/Kconfig                            |   2 +-
>  drivers/cpufreq/cpufreq-cpu0.c                     |  16 +
>  drivers/hwmon/lm75.c                               |  35 +-
>  drivers/hwmon/tmp102.c                             |  19 +
>  drivers/thermal/Kconfig                            |  14 +
>  drivers/thermal/Makefile                           |   1 +
>  drivers/thermal/cpu_cooling.c                      |  56 +-
>  drivers/thermal/of-thermal.c                       | 845 +++++++++++++++++++++
>  drivers/thermal/thermal_core.c                     |  79 +-
>  drivers/thermal/thermal_core.h                     |   9 +
>  drivers/thermal/ti-soc-thermal/ti-thermal-common.c |  77 +-
>  include/dt-bindings/thermal/thermal.h              |  27 +
>  include/linux/cpu_cooling.h                        |  25 +
>  include/linux/thermal.h                            |  32 +-
>  22 files changed, 1880 insertions(+), 43 deletions(-)
>  create mode 100644 Documentation/devicetree/bindings/thermal/thermal.txt
>  create mode 100644 arch/arm/boot/dts/omap4-cpu-thermal.dtsi
>  create mode 100644 arch/arm/boot/dts/omap5-core-thermal.dtsi
>  create mode 100644 arch/arm/boot/dts/omap5-gpu-thermal.dtsi
>  create mode 100644 drivers/thermal/of-thermal.c
>  create mode 100644 include/dt-bindings/thermal/thermal.h
> 


-- 
You have got to be excited about what you are doing. (L. Lamport)

Eduardo Valentin


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