| lists.openwall.net | lists / announce owl-users owl-dev john-users john-dev passwdqc-users yescrypt popa3d-users / oss-security kernel-hardening musl sabotage tlsify passwords / crypt-dev xvendor / Bugtraq Full-Disclosure linux-kernel linux-netdev linux-ext4 linux-hardening linux-cve-announce PHC | |
|
Open Source and information security mailing list archives
| ||
|
Date: Mon, 9 Feb 2015 17:34:02 -0400 From: Eduardo Valentin <edubezval@...il.com> To: Rui Zhang <rui.zhang@...el.com>, ezequiel.garcia@...e-electrons.com, amit.kachhap@...aro.org, viresh.kumar@...aro.org, amit.daniel@...sung.com, hongbo.zhang@...aro.com, andrew@...n.ch, durgadoss.r@...el.com, peter@...e.net, shawn.guo@...aro.org, aaron.lu@...el.com, caesar.wang@...k-chips.com, b.zolnierkie@...sung.com, l.majewski@...sung.com, vincenzo.frascino@...com, mperttunen@...dia.com, mikko.perttunen@...si.fi, srinivas.pandruvada@...ux.intel.com, jacob.jun.pan@...ux.intel.com, bcousson@...libre.com Cc: LKML <linux-kernel@...r.kernel.org>, Linux PM <linux-pm@...r.kernel.org>, Eduardo Valentin <edubezval@...il.com> Subject: [PATCH RFC 01/12] Documentation: Introduce Linux Kernel Thermal Framework DocBook This patch adds a book about the Linux Kernel Thermal Framework. In this change, only a brief introduction is added together with Makefile changes. Signed-off-by: Eduardo Valentin <edubezval@...il.com> --- Documentation/DocBook/Makefile | 3 +- Documentation/DocBook/thermal.tmpl | 88 ++++++++++++++++++++++++++++++++++++++ 2 files changed, 90 insertions(+), 1 deletion(-) create mode 100644 Documentation/DocBook/thermal.tmpl diff --git a/Documentation/DocBook/Makefile b/Documentation/DocBook/Makefile index 9c7d92d..8163508 100644 --- a/Documentation/DocBook/Makefile +++ b/Documentation/DocBook/Makefile @@ -15,7 +15,8 @@ DOCBOOKS := z8530book.xml device-drivers.xml \ 80211.xml debugobjects.xml sh.xml regulator.xml \ alsa-driver-api.xml writing-an-alsa-driver.xml \ tracepoint.xml drm.xml media_api.xml w1.xml \ - writing_musb_glue_layer.xml crypto-API.xml + writing_musb_glue_layer.xml crypto-API.xml thermal.xml + writing_musb_glue_layer.xml include Documentation/DocBook/media/Makefile diff --git a/Documentation/DocBook/thermal.tmpl b/Documentation/DocBook/thermal.tmpl new file mode 100644 index 0000000..f8fb8a2 --- /dev/null +++ b/Documentation/DocBook/thermal.tmpl @@ -0,0 +1,88 @@ +<?xml version="1.0" encoding="UTF-8"?> +<!DOCTYPE book PUBLIC "-//OASIS//DTD DocBook XML V4.1.2//EN" + "http://www.oasis-open.org/docbook/xml/4.1.2/docbookx.dtd" []> + +<book id="thermal-api"> + <bookinfo> + <title>Linux Kernel Thermal Framework API</title> + + <authorgroup> + <author> + <firstname>Eduardo</firstname> + <surname>Valentin</surname> + <affiliation> + <address> + <email>evalenti@...nel.org</email> + </address> + </affiliation> + </author> + </authorgroup> + + <copyright> + <year>2008-2014</year> + <holder>Eduardo Valentin</holder> + <holder>Sujith Thomas</holder> + <holder>Zhang Rui</holder> + </copyright> + <legalnotice> + <para> + This documentation is free software; you can redistribute + it and/or modify it under the terms of the GNU General Public + License version 2 as published by the Free Software Foundation. + </para> + + <para> + This program is distributed in the hope that it will be + useful, but WITHOUT ANY WARRANTY; without even the implied + warranty of MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. + See the GNU General Public License for more details. + </para> + + <para> + For more details see the file COPYING in the source + distribution of Linux. + </para> + </legalnotice> + </bookinfo> + +<toc></toc> + + <chapter id="introduction"> + <title>Introduction</title> + <para>Thermal management is any method or technique implied to + mitigate emergencies caused by operating devices within + unsupported temperatures. The challenge consists of designing a + product keeping the junction temperature of the IC components. + The operating temperature of IC components used on products must + operate within their design limits. Besides, temperature towards + device enclosure must be in a comfort level for the user. + Therefore, thermal management, by the time of this writing, + starts in very early device design phase. Managing thermal may + involve different disciplines, at different stages, such as + temperature monitoring, floorplanning, microarchitectural + techniques, compiler techniques, OS techniques, liquid cooling, + and thermal reliability or security. This document covers what + the Linux Kernel Thermal Framework provides as abstraction to + users with respect to thermal management. + </para> + <para>One of the first proposals to provide a solution to cover + the thermal problem appears in the Advanced Configuration and + Power Interface (ACPI) specification. ACPI provides an open + standard for device configuration and power management by the + operating system. However, several computing devices which may + have thermal issues in the market disregard the ACPI standard. + Therefore, the Linux Kernel Thermal Framework has been designed + to serve as abstraction for ACPI and non-ACPI systems. The core + concepts applies in both types of systems. + </para> + <para>The Linux Kernel Thermal Framework has a design which + represents the different thermal constraints found in an + end-products. The thermal constraints exist to serve different + purposes. There two major types of thermal constraints. The + first is related to components junction temperature. The second + is related to the level of comfort while end users are handling + devices. + </para> + + </chapter> +</book> -- 2.1.3 -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majordomo@...r.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/
Powered by blists - more mailing lists