linux-kernel - [PATCH 0/2] More thermal configuration for Fairphone 4

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Date: Fri, 05 Jan 2024 15:54:26 +0100
From: Luca Weiss <luca.weiss@...rphone.com>
To: Bjorn Andersson <andersson@...nel.org>, 
 Konrad Dybcio <konrad.dybcio@...aro.org>, Rob Herring <robh+dt@...nel.org>, 
 Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>, 
 Conor Dooley <conor+dt@...nel.org>
Cc: ~postmarketos/upstreaming@...ts.sr.ht, phone-devel@...r.kernel.org, 
 linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org, 
 linux-kernel@...r.kernel.org, Luca Weiss <luca.weiss@...rphone.com>
Subject: [PATCH 0/2] More thermal configuration for Fairphone 4

Add the thermal configuration for the thermistors connected to PMK8003
and PM6150L. With that all the external thermistors on the phone should
be present in the dts.

Signed-off-by: Luca Weiss <luca.weiss@...rphone.com>
---
Luca Weiss (2):
      arm64: dts: qcom: sm7225-fairphone-fp4: Add PMK8003 thermals
      arm64: dts: qcom: sm7225-fairphone-fp4: Add PM6150L thermals

 arch/arm64/boot/dts/qcom/sm7225-fairphone-fp4.dts | 216 ++++++++++++++++++++++
 1 file changed, 216 insertions(+)
---
base-commit: 50c107ee601a3d57e4fb13a9ecd9cf6c8df187f2
change-id: 20240105-fp4-thermals-f3c8e0417b70

Best regards,
-- 
Luca Weiss <luca.weiss@...rphone.com>