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Date:	Thu, 11 Jun 2009 05:44:41 -0700 (PDT)
From:	David Miller <davem@...emloft.net>
To:	shemminger@...tta.com
Cc:	kaber@...sh.net, fubar@...ibm.com, stable@...nel.org,
	linux-kernel@...r.kernel.org
Subject: Re: [PATCH] bonding: fix multiple module load problem

From: Stephen Hemminger <shemminger@...tta.com>
Date: Tue, 9 Jun 2009 23:07:54 -0700

> Some users still load bond module multiple times to create bonding
> devices.  This accidentally was broken by a later patch about
> the time sysfs was fixed.  According to Jay, it was broken
> by:
>    commit b8a9787eddb0e4665f31dd1d64584732b2b5d051
>    Author: Jay Vosburgh <fubar@...ibm.com>
>    Date:   Fri Jun 13 18:12:04 2008 -0700
> 
>      bonding: Allow setting max_bonds to zero
> 
> Note: sysfs and procfs still produce WARN() messages when this is done
> so the sysfs method is the recommended API.
> 
> Signed-off-by: Stephen Hemminger <shemminger@...tta.com>

Applied, and queued up for -stable, thanks!
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