linux-kernel - Re: [RFC PATCH 0/2] thermal: Add generic cpu cooling devices according to thermal framework

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Message-ID: <1328253147.20438.19.camel@rui.sh.intel.com>
Date:	Fri, 03 Feb 2012 15:12:27 +0800
From:	Zhang Rui <rui.zhang@...el.com>
To:	Amit Kachhap <amit.kachhap@...aro.org>
Cc:	linux-pm@...ts.linux-foundation.org, linux-kernel@...r.kernel.org,
	mjg59@...f.ucam.org, linux-acpi@...r.kernel.org, lenb@...nel.org,
	linaro-dev@...ts.linaro.org, patches@...aro.org
Subject: Re: [RFC PATCH 0/2] thermal: Add generic cpu cooling devices
 according to thermal framework

Hi, sorry for the late response.

On 四, 2012-01-19 at 14:47 +0530, Amit Kachhap wrote:
> On 13 December 2011 20:43, Amit Daniel Kachhap <amit.kachhap@...aro.org> wrote:
> > PATCH 1)  [thermal: Add a new trip type to use cooling device instance number]
> > This patch adds a new trip type THERMAL_TRIP_STATE_ACTIVE which passes
> > cooling device instance number and may be helpful for cpufreq cooling devices
> > to take the correct cooling action.
> >
Sorry, I'm still not quite clear about how this will be used.
Say, processor has P0~P3, then we need to register a thermal zone with
three STATE_ACTIVE trip points, like the picture shown below?

processor in full speed, i.e. P0
---------------------------- 
state active trip point 1
----------------------------
processor in P1
----------------------------
state active trip point 2
----------------------------
processor in P2
----------------------------
state active trip point 3
----------------------------
processor in P3

> > PATCH 2)  [thermal: Add generic cpu cooling implementation]
> > This patch adds generic cpu cooling low level implementation through frequency
> > clipping and cpu hotplug. In future, other cpu related cooling devices may be
> > added here. An ACPI version of this already exists(drivers/acpi/processor_thermal.c).
> > But this will be useful for platforms like ARM using the generic thermal interface
> > along with the generic cpu cooling devices. The cooling device registration API's
> > return cooling device pointers which can be easily binded with the thermal zone
> > trip points.
> >
It seems that we can convert the ACPI processor thermal driver to follow
this generic cpu cooling implementation, right?

thanks,
rui
> 
> Any comments on these patches? I submitted them quite long back.
> 
> Regards,
> Amit D
> 
> >
> > Amit Daniel Kachhap (2):
> >  thermal: Add a new trip type to use cooling device instance number
> >  thermal: Add generic cpu cooling implementation
> >
> >  Documentation/thermal/cpu-cooling-api.txt |   52 +++++
> >  Documentation/thermal/sysfs-api.txt       |    4 +-
> >  drivers/thermal/Kconfig                   |   11 +
> >  drivers/thermal/Makefile                  |    1 +
> >  drivers/thermal/cpu_cooling.c             |  302 +++++++++++++++++++++++++++++
> >  drivers/thermal/thermal_sys.c             |   27 +++-
> >  include/linux/cpu_cooling.h               |   45 +++++
> >  include/linux/thermal.h                   |    1 +
> >  8 files changed, 440 insertions(+), 3 deletions(-)
> >  create mode 100644 Documentation/thermal/cpu-cooling-api.txt
> >  create mode 100644 drivers/thermal/cpu_cooling.c
> >  create mode 100644 include/linux/cpu_cooling.h
> >


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