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Message-Id: <20120508131616.f60c1f90.akpm@linux-foundation.org>
Date: Tue, 8 May 2012 13:16:16 -0700
From: Andrew Morton <akpm@...ux-foundation.org>
To: Amit Daniel Kachhap <amit.kachhap@...aro.org>
Cc: linux-pm@...ts.linux-foundation.org, durgadoss.r@...el.com,
linux-acpi@...r.kernel.org, lenb@...nel.org, rui.zhang@...el.com,
linaro-dev@...ts.linaro.org, linux-kernel@...r.kernel.org,
linux-arm-kernel@...ts.infradead.org,
linux-samsung-soc@...r.kernel.org, patches@...aro.org
Subject: Re: [PATCH v3 0/6] thermal: exynos: Add kernel thermal support for
exynos platform
On Tue, 8 May 2012 21:48:12 +0530
Amit Daniel Kachhap <amit.kachhap@...aro.org> wrote:
> This patchset introduces a new generic cooling device based on cpufreq that
> can be used on non-ACPI platforms. As a proof of concept, we have drivers for
> the following platforms using this mechanism now:
>
> * TI OMAP (git://git.linaro.org/people/amitdanielk/linux.git omap4460_thermal)
> * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
> * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)
>
> These patches have been reviewed by Rui Zhang (https://lkml.org/lkml/2012/4/9/448)
But we don't have explicit Reviewed-by:s for the changelogs?
> who seems to agree with them in principle, but I haven't had any luck getting them
> merged, perhaps a lack of maintainer bandwidth.
>
> ACPI platforms currently have such a mechanism but it is wrapped in ACPI'isms
> that we don't have on ARM platforms. If this is accepted, I'm proposing to
> convert over the ACPI thermal driver to use this common code too.
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