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Message-Id: <201209102223.53094.rjw@sisk.pl>
Date: Mon, 10 Sep 2012 22:23:52 +0200
From: "Rafael J. Wysocki" <rjw@...k.pl>
To: linux-pm@...ts.linux-foundation.org
Cc: Zhang Rui <rui.zhang@...el.com>, linux-samsung-soc@...r.kernel.org,
SangWook Ju <sw.ju@...sung.com>, linux-kernel@...r.kernel.org,
lm-sensors@...sensors.org, linux-acpi@...r.kernel.org,
Jean Delvare <khali@...ux-fr.org>,
Kyungmin Park <kmpark@...radead.org>,
Andrew Morton <akpm@...ux-foundation.org>,
Guenter Roeck <guenter.roeck@...csson.com>
Subject: Re: [linux-pm] [PATCH RESEND] thermal: add generic cpufreq cooling implementation
On Monday, September 10, 2012, Zhang Rui wrote:
> Refreshed to remove the notifier mechanism as we do not have a real user of it.
> if there is no problem, I'll apply the whole patch set to thermal next tree.
>
> From: Amit Daniel Kachhap <amit.kachhap@...aro.org>
> Date: Thu, 16 Aug 2012 17:11:40 +0530
>
> This patchset introduces a new generic cooling device based on cpufreq
> that can be used on non-ACPI platforms. As a proof of concept, we have
> drivers for the following platforms using this mechanism now:
>
> * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
> * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)
>
> There is a small change in cpufreq cooling registration APIs, so a minor
> change is needed for Freescale platforms.
>
> Brief Description:
>
> 1) The generic cooling devices code is placed inside driver/thermal/*
> as placing inside acpi folder will need un-necessary enabling of acpi
> code. This code is architecture independent.
>
> 2) This patchset adds generic cpu cooling low level implementation
> through frequency clipping. In future, other cpu related cooling
> devices may be added here. An ACPI version of this already exists
> (drivers/acpi/processor_thermal.c) .But this will be useful for
> platforms like ARM using the generic thermal interface along with the
> generic cpu cooling devices. The cooling device registration API's
> return cooling device pointers which can be easily binded with the
> thermal zone trip points. The important APIs exposed are,
>
> a) struct thermal_cooling_device *cpufreq_cooling_register(
> struct cpumask *clip_cpus)
> b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
>
> 3) Samsung exynos platform thermal implementation is done using the
> generic cpu cooling APIs and the new trip type. The temperature sensor
> driver present in the hwmon folder(registered as hwmon driver) is moved
> to thermal folder and registered as a thermal driver.
>
> A simple data/control flow diagrams is shown below,
>
> Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor
> | |
> \|/ |
> Cpufreq cooling device <---------------
>
> TODO:
> *Will send the DT enablement patches later after the driver is merged.
>
> This patch:
>
> Add support for generic cpu thermal cooling low level implementations
> using frequency scaling up/down based on the registration parameters.
> Different cpu related cooling devices can be registered by the user and
> the binding of these cooling devices to the corresponding trip points can
> be easily done as the registration APIs return the cooling device pointer.
> The user of these APIs are responsible for passing clipping frequency .
> The drivers can also register to recieve notification about any cooling
> action called.
>
> Cc: Guenter Roeck <guenter.roeck@...csson.com>
> Cc: SangWook Ju <sw.ju@...sung.com>
> Cc: Durgadoss <durgadoss.r@...el.com>
> Cc: Len Brown <lenb@...nel.org>
> Cc: Jean Delvare <khali@...ux-fr.org>
> Cc: Kyungmin Park <kmpark@...radead.org>
> Cc: Kukjin Kim <kgene.kim@...sung.com>
> Signed-off-by: Zhang Rui <rui.zhang@...el.com>
> Signed-off-by: Andrew Morton <akpm@...ux-foundation.org>
> Signed-off-by: Amit Daniel Kachhap <amit.daniel@...sung.com>
Can you please resend the patch inline (i.e. not as an attachment)?
Rafael
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