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Message-ID: <1351674176-20603-3-git-send-email-ldewangan@nvidia.com>
Date:	Wed, 31 Oct 2012 14:32:54 +0530
From:	Laxman Dewangan <ldewangan@...dia.com>
To:	<swarren@...dotorg.org>, <linux@....linux.org.uk>
CC:	<linux-tegra@...r.kernel.org>,
	<linux-arm-kernel@...ts.infradead.org>,
	<linux-kernel@...r.kernel.org>,
	Laxman Dewangan <ldewangan@...dia.com>
Subject: [PATCH V4 3/4] ARM: tegra: dts: cardhu: enable SLINK4

Enable SLINK4 and connected device in Tegra30 based
platform Cardhu.
Setting maximum spi frequency to 25MHz.

Spi serial flash is connected on CS1 of SLINK4 on
cardhu platform.

Signed-off-by: Laxman Dewangan <ldewangan@...dia.com>
---
Changes from V1:
- rename the max freq prop to spi-max-frequency

Changes from V2:
- make node name to spi@

Changes from V3:
- Add winbond spi flash as cs1 for slink4.
- Add winbond company name in vendor list.

 .../devicetree/bindings/vendor-prefixes.txt        |    1 +
 arch/arm/boot/dts/tegra30-cardhu.dtsi              |   10 ++++++++++
 2 files changed, 11 insertions(+), 0 deletions(-)

diff --git a/Documentation/devicetree/bindings/vendor-prefixes.txt b/Documentation/devicetree/bindings/vendor-prefixes.txt
index 9de2b9f..ac2c2c4 100644
--- a/Documentation/devicetree/bindings/vendor-prefixes.txt
+++ b/Documentation/devicetree/bindings/vendor-prefixes.txt
@@ -51,4 +51,5 @@ ti	Texas Instruments
 via	VIA Technologies, Inc.
 wlf	Wolfson Microelectronics
 wm	Wondermedia Technologies, Inc.
+winbond Winbond Electronics corp.
 xlnx	Xilinx
diff --git a/arch/arm/boot/dts/tegra30-cardhu.dtsi b/arch/arm/boot/dts/tegra30-cardhu.dtsi
index b245e6c..b4e0eda 100644
--- a/arch/arm/boot/dts/tegra30-cardhu.dtsi
+++ b/arch/arm/boot/dts/tegra30-cardhu.dtsi
@@ -275,6 +275,16 @@
 		};
 	};
 
+	spi@...0da00 {
+		status = "okay";
+		spi-max-frequency = <25000000>;
+		spi-flash@1 {
+			compatible = "winbond,w25q32";
+			spi-max-frequency = <20000000>;
+			reg = <1>;
+		};
+	};
+
 	ahub {
 		i2s@...80400 {
 			status = "okay";
-- 
1.7.1.1

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