[<prev] [next>] [<thread-prev] [thread-next>] [day] [month] [year] [list]
Message-ID: <20130716201702.GW17211@twins.programming.kicks-ass.net>
Date: Tue, 16 Jul 2013 22:17:02 +0200
From: Peter Zijlstra <peterz@...radead.org>
To: Arjan van de Ven <arjan@...ux.intel.com>
Cc: Morten Rasmussen <morten.rasmussen@....com>, mingo@...nel.org,
vincent.guittot@...aro.org, preeti@...ux.vnet.ibm.com,
alex.shi@...el.com, efault@....de, pjt@...gle.com,
len.brown@...el.com, corbet@....net, akpm@...ux-foundation.org,
torvalds@...ux-foundation.org, tglx@...utronix.de,
catalin.marinas@....com, linux-kernel@...r.kernel.org,
linaro-kernel@...ts.linaro.org
Subject: Re: [RFC][PATCH 0/9] sched: Power scheduler design proposal
On Tue, Jul 16, 2013 at 12:57:34PM -0700, Arjan van de Ven wrote:
> then the question of how much remaining capacity; this is a hard one, and not just
> for Intel. Almost all mobile devices today are thermally constrained, ARM and Intel
> alike (at least the higher performance ones)... the curse of wanting very thin and light
> phones that are made of thermally isolating plastic (so that radio waves can go through)
> and have a nice and bright screen...
Right, so we might need to track a !idle avg over the thermal domain to
guestimate the head-room and inter-cpu relations.
But yeah, I suppose what I've been saying is that we need to drag
cpufreq into the SMP era. Only considering a single cpu isn't going to
work anymore.
--
To unsubscribe from this list: send the line "unsubscribe linux-kernel" in
the body of a message to majordomo@...r.kernel.org
More majordomo info at http://vger.kernel.org/majordomo-info.html
Please read the FAQ at http://www.tux.org/lkml/
Powered by blists - more mailing lists