linux-kernel - Re: [RFC 2/2] usb: dwc3: Add Qualcomm DWC3 glue layer driver

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Date:	Tue, 06 Aug 2013 17:41:36 +0300
From:	"Ivan T. Ivanov" <iivanov@...sol.com>
To:	Mark Rutland <mark.rutland@....com>
Cc:	"balbi@...com" <balbi@...com>,
	"rob.herring@...xeda.com" <rob.herring@...xeda.com>,
	Pawel Moll <Pawel.Moll@....com>,
	"swarren@...dotorg.org" <swarren@...dotorg.org>,
	"ian.campbell@...rix.com" <ian.campbell@...rix.com>,
	"rob@...dley.net" <rob@...dley.net>,
	"gregkh@...uxfoundation.org" <gregkh@...uxfoundation.org>,
	"grant.likely@...aro.org" <grant.likely@...aro.org>,
	"devicetree@...r.kernel.org" <devicetree@...r.kernel.org>,
	"linux-doc@...r.kernel.org" <linux-doc@...r.kernel.org>,
	"linux-kernel@...r.kernel.org" <linux-kernel@...r.kernel.org>,
	"linux-usb@...r.kernel.org" <linux-usb@...r.kernel.org>,
	"linux-omap@...r.kernel.org" <linux-omap@...r.kernel.org>
Subject: Re: [RFC 2/2] usb: dwc3: Add Qualcomm DWC3 glue layer driver


Hi, 

On Tue, 2013-08-06 at 15:07 +0100, Mark Rutland wrote:
> On Tue, Aug 06, 2013 at 12:53:11PM +0100, Ivan T. Ivanov wrote:
> > From: "Ivan T. Ivanov" <iivanov@...sol.com>
> 
> What does the "glue layer" do? Is it an actual piece of hardware, or
> just some platform-specific code?
> 

It is hardware layer around Synopsys DesignWare USB3 core. The 
term 'glue layer' is what is used in TI OMAP's and Samsung Exynos
drivers implementations.

> > 
> > Signed-off-by: Ivan T. Ivanov <iivanov@...sol.com>
> > ---
> >  .../devicetree/bindings/usb/msm-ssusb.txt          |   39 +++++
> >  drivers/usb/dwc3/Kconfig                           |    8 +
> >  drivers/usb/dwc3/Makefile                          |    1 +
> >  drivers/usb/dwc3/dwc3-msm.c                        |  175 ++++++++++++++++++++
> >  4 files changed, 223 insertions(+)
> >  create mode 100644 drivers/usb/dwc3/dwc3-msm.c
> > 
> > diff --git a/Documentation/devicetree/bindings/usb/msm-ssusb.txt b/Documentation/devicetree/bindings/usb/msm-ssusb.txt
> > index 550b496..313ae0d 100644
> > --- a/Documentation/devicetree/bindings/usb/msm-ssusb.txt
> > +++ b/Documentation/devicetree/bindings/usb/msm-ssusb.txt
> > @@ -22,6 +22,23 @@ Required "supply-name" examples are:
> >  	"v1p8" : 1.8v supply for SS-PHY
> >  	"vddcx" : vdd supply for SS-PHY digital circuit operation
> >  
> > +Required properties :
> > +- compatible : should be "qcom,dwc-usb3-msm"
> > +- reg : offset and length of the register set in the memory map
> > +	offset and length of the TCSR register for routing USB
> > +	signals to either picoPHY0 or picoPHY1.
> > +- clocks = <&usb30_master_cxc>, <&sys_noc_usb3_axi_cxc>, <&usb30_sleep_cxc>, <&usb30_mock_utmi_cxc>;
> 
> Similarly to my comment on patch 1, these need to be described better.

Sure, will fix this.

Thanks, 
Ivan

> 
> Thanks,
> Mark.


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