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Date:	Wed, 14 Aug 2013 12:43:24 +0300
From:	"Ivan T. Ivanov" <iivanov@...sol.com>
To:	balbi@...com
Cc:	rob.herring@...xeda.com, pawel.moll@....com, mark.rutland@....com,
	swarren@...dotorg.org, ian.campbell@...rix.com, rob@...dley.net,
	gregkh@...uxfoundation.org, grant.likely@...aro.org,
	devicetree@...r.kernel.org, linux-doc@...r.kernel.org,
	linux-kernel@...r.kernel.org, linux-usb@...r.kernel.org,
	linux-omap@...r.kernel.org
Subject: Re: [RFC 2/2] usb: dwc3: Add Qualcomm DWC3 glue layer driver

Hi, 

On Fri, 2013-08-09 at 16:23 +0300, Felipe Balbi wrote:

<snip>

> 
> > +	/*
> > +	 * DWC3 Core requires its CORE CLK (aka master / bus clk) to
> > +	 * run at 125Mhz in SSUSB mode and >60MHZ for HSUSB mode.
> > +	 */
> > +	clk_set_rate(mdwc->core_clk, 125000000);
> 
> if this is dwc3's core clock, why don't we teach dwc3.ko about this
> requirement ? Just make sure to have it optional, since x86 and OMAP
> wouldn't need direct fiddling with the clocks.

I believe this is Qualcomm specific requirement. Something is modified
inside DWC in respect of the clocks. I will like to keep this here, in
the glue layer driver.

Regards,
Ivan


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