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Message-ID: <1384285582-16933-1-git-send-email-eduardo.valentin@ti.com>
Date: Tue, 12 Nov 2013 15:46:02 -0400
From: Eduardo Valentin <eduardo.valentin@...com>
To: <swarren@...dotorg.org>, <pawel.moll@....com>,
<mark.rutland@....com>, <ian.campbell@...rix.com>,
<rob.herring@...xeda.com>, <linux@...ck-us.net>,
<rui.zhang@...el.com>
CC: <wni@...dia.com>, <grant.likely@...aro.org>,
<durgadoss.r@...el.com>, <linux-pm@...r.kernel.org>,
<devicetree@...r.kernel.org>, <lm-sensors@...sensors.org>,
<linux-kernel@...r.kernel.org>,
Eduardo Valentin <eduardo.valentin@...com>
Subject: [PATCHv5 00/20] device thermal limits represented in device tree nodes (v5)
Hello all,
Here is v5 of the work of representing hardware thermal properties
in device tree infrastructure. Previous versions can be
found here:
V4: https://lkml.org/lkml/2013/9/26/787
V3: https://lkml.org/lkml/2013/9/15/122
RFCv2: http://lkml.org/lkml/2013/8/23/594
RFCv1: http://lkml.org/lkml/2013/7/22/319
The differences from V4 of this series are pretty minor. Here is a shortlog:
1. Rephrased couple of sentences and improved description of a couple of properties.
2. Removed the macro constants for trip type from the binding header file.
3. Due to (3), patches 09/14/15 were adapted to use plain string constants
4. As per suggestion by Nishanth M. I also included in this series two
patches to move TI bandgap nodes to belong under OCP.
5. I volunteered to maintain the thermal binding, so added that to MAINTAINERS.
This specific series has been tested on OMAP4430, OMAP4460, OMAP5432 and DRA7.
All best,
Eduardo Valentin (20):
thermal: allow registering without .get_temp
thermal: introduce device tree parser
thermal: core: introduce thermal_of_cooling_device_register
thermal: cpu_cooling: introduce of_cpufreq_cooling_register
cpufreq: cpufreq-cpu0: add dt node parsing for cooling device
properties
hwmon: lm75: expose to thermal fw via DT nodes
hwmon: tmp102: expose to thermal fw via DT nodes
thermal: ti-soc-thermal: use thermal DT infrastructure
arm: dts: add omap4 CPU thermal data
arm: dts: add omap4430 thermal data
arm: dts: add omap4460 thermal data
arm: dts: add cooling properties on omap4430 cpu node
arm: dts: add cooling properties on omap4460 cpu node
arm: dts: add omap5 GPU thermal data
arm: dts: add omap5 CORE thermal data
arm: dts: add omap5 thermal data
arm: dts: add cooling properties on omap5 cpu node
arm: dts: make OMAP443x bandgap node to belong to OCP
arm: dts: make OMAP4460 bandgap node to belong to OCP
MAINTAINERS: add maintainer entry for thermal bindings
.../devicetree/bindings/cpufreq/cpufreq-cpu0.txt | 7 +
.../devicetree/bindings/thermal/thermal.txt | 586 ++++++++++++++
MAINTAINERS | 1 +
arch/arm/boot/dts/omap4-cpu-thermal.dtsi | 41 +
arch/arm/boot/dts/omap443x.dtsi | 23 +-
arch/arm/boot/dts/omap4460.dtsi | 29 +-
arch/arm/boot/dts/omap5-core-thermal.dtsi | 28 +
arch/arm/boot/dts/omap5-gpu-thermal.dtsi | 28 +
arch/arm/boot/dts/omap5.dtsi | 15 +-
drivers/cpufreq/Kconfig | 2 +-
drivers/cpufreq/cpufreq-cpu0.c | 16 +
drivers/hwmon/lm75.c | 35 +-
drivers/hwmon/tmp102.c | 19 +
drivers/thermal/Kconfig | 14 +
drivers/thermal/Makefile | 1 +
drivers/thermal/cpu_cooling.c | 56 +-
drivers/thermal/of-thermal.c | 849 +++++++++++++++++++++
drivers/thermal/thermal_core.c | 77 +-
drivers/thermal/thermal_core.h | 9 +
drivers/thermal/ti-soc-thermal/ti-thermal-common.c | 77 +-
include/dt-bindings/thermal/thermal.h | 17 +
include/linux/cpu_cooling.h | 25 +
include/linux/thermal.h | 32 +-
23 files changed, 1936 insertions(+), 51 deletions(-)
create mode 100644 Documentation/devicetree/bindings/thermal/thermal.txt
create mode 100644 arch/arm/boot/dts/omap4-cpu-thermal.dtsi
create mode 100644 arch/arm/boot/dts/omap5-core-thermal.dtsi
create mode 100644 arch/arm/boot/dts/omap5-gpu-thermal.dtsi
create mode 100644 drivers/thermal/of-thermal.c
create mode 100644 include/dt-bindings/thermal/thermal.h
--
1.8.2.1.342.gfa7285d
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