linux-kernel - [PATCH v3 0/3] usb: chipidea: msm: Clean and fix glue layer driver

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Message-Id: <1398159797-26917-1-git-send-email-iivanov@mm-sol.com>
Date:	Tue, 22 Apr 2014 12:43:14 +0300
From:	"Ivan T. Ivanov" <iivanov@...sol.com>
To:	Peter Chen <Peter.Chen@...escale.com>
Cc:	"Ivan T. Ivanov" <iivanov@...sol.com>,
	Greg Kroah-Hartman <gregkh@...uxfoundation.org>,
	linux-kernel@...r.kernel.org, linux-usb@...r.kernel.org,
	linux-arm-msm@...r.kernel.org
Subject: [PATCH v3 0/3] usb: chipidea: msm: Clean and fix glue layer driver

From: "Ivan T. Ivanov" <iivanov@...sol.com>

This series intend to fix driver, which was broken for a while.
It is used to create peripheral role device, which in coordination
with phy-usb-msm driver could provide USB2.0 gadget support for
Qualcomm targets.

Changes since version 2.

 - Rename devicetree description file to ci-hdrc-qcom.txt to be in-line
   with Freescale and Zevio naming scheme
 - Use better name for usb-phy phandle.
 - Make of_device_id structure const

[1] https://lkml.org/lkml/2014/2/18/209

Ivan T. Ivanov (3):
  usb: chipidea: msm: Add device tree binding information
  usb: chipidea: msm: Add device tree support
  usb: chipidea: msm: Initialize offset of the capability registers

 .../devicetree/bindings/usb/ci-hdrc-qcom.txt       | 17 +++++++++++++++
 drivers/usb/chipidea/ci_hdrc_msm.c                 | 24 +++++++++++++++++++++-
 2 files changed, 40 insertions(+), 1 deletion(-)
 create mode 100644 Documentation/devicetree/bindings/usb/ci-hdrc-qcom.txt

--
1.8.3.2

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