linux-kernel - Re: [PATCH v3 0/3] usb: chipidea: msm: Clean and fix glue layer driver

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Date:	Wed, 23 Apr 2014 16:23:02 +0800
From:	Peter Chen <peter.chen@...escale.com>
To:	"Ivan T. Ivanov" <iivanov@...sol.com>
CC:	Greg Kroah-Hartman <gregkh@...uxfoundation.org>,
	<linux-kernel@...r.kernel.org>, <linux-usb@...r.kernel.org>,
	<linux-arm-msm@...r.kernel.org>
Subject: Re: [PATCH v3 0/3] usb: chipidea: msm: Clean and fix glue layer
 driver

On Tue, Apr 22, 2014 at 12:43:14PM +0300, Ivan T. Ivanov wrote:
> From: "Ivan T. Ivanov" <iivanov@...sol.com>
> 
> This series intend to fix driver, which was broken for a while.
> It is used to create peripheral role device, which in coordination
> with phy-usb-msm driver could provide USB2.0 gadget support for
> Qualcomm targets.
> 
> Changes since version 2.
> 
>  - Rename devicetree description file to ci-hdrc-qcom.txt to be in-line
>    with Freescale and Zevio naming scheme
>  - Use better name for usb-phy phandle.
>  - Make of_device_id structure const
> 
> [1] https://lkml.org/lkml/2014/2/18/209
> 
> Ivan T. Ivanov (3):
>   usb: chipidea: msm: Add device tree binding information
>   usb: chipidea: msm: Add device tree support
>   usb: chipidea: msm: Initialize offset of the capability registers
> 
>  .../devicetree/bindings/usb/ci-hdrc-qcom.txt       | 17 +++++++++++++++
>  drivers/usb/chipidea/ci_hdrc_msm.c                 | 24 +++++++++++++++++++++-
>  2 files changed, 40 insertions(+), 1 deletion(-)
>  create mode 100644 Documentation/devicetree/bindings/usb/ci-hdrc-qcom.txt
> 
> --
> 1.8.3.2
> 
> 
> 

This patchset looks ok except the typo which Srinivas Kandagatla mentions.

-- 

Best Regards,
Peter Chen
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