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Message-Id: <1398256084-6815-1-git-send-email-iivanov@mm-sol.com> Date: Wed, 23 Apr 2014 15:28:01 +0300 From: "Ivan T. Ivanov" <iivanov@...sol.com> To: Peter Chen <Peter.Chen@...escale.com> Cc: "Ivan T. Ivanov" <iivanov@...sol.com>, Greg Kroah-Hartman <gregkh@...uxfoundation.org>, linux-kernel@...r.kernel.org, linux-usb@...r.kernel.org, linux-arm-msm@...r.kernel.org Subject: [PATCH v4 0/3] usb: chipidea: msm: Clean and fix glue layer driver From: "Ivan T. Ivanov" <iivanov@...sol.com> This series intend to fix driver, which was broken for a while. It is used to create peripheral role device, which in coordination with phy-usb-msm driver could provide USB2.0 gadget support for Qualcomm targets. Changes since version 3. - Fix typo in devicetree description file. Previews version can be found here: https://lkml.org/lkml/2014/4/22/195 Ivan T. Ivanov (3): usb: chipidea: msm: Add device tree binding information usb: chipidea: msm: Add device tree support usb: chipidea: msm: Initialize offset of the capability registers .../devicetree/bindings/usb/ci-hdrc-qcom.txt | 17 +++++++++++++++ drivers/usb/chipidea/ci_hdrc_msm.c | 24 +++++++++++++++++++++- 2 files changed, 40 insertions(+), 1 deletion(-) create mode 100644 Documentation/devicetree/bindings/usb/ci-hdrc-qcom.txt -- 1.8.3.2 -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majordomo@...r.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/
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