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Date:	Fri, 25 Apr 2014 15:11:52 +0100
From:	Mark Brown <broonie@...nel.org>
To:	Robert Baldyga <r.baldyga@...sung.com>
Cc:	robh+dt@...nel.org, pawel.moll@....com, mark.rutland@....com,
	ijc+devicetree@...lion.org.uk, galak@...eaurora.org,
	rob@...dley.net, myungjoo.ham@...sung.com, cw00.choi@...sung.com,
	dbaryshkov@...il.com, dwmw2@...radead.org, balbi@...com,
	gregkh@...uxfoundation.org, grant.likely@...aro.org,
	ldewangan@...dia.com, kishon@...com, gg@...mlogic.co.uk,
	anton@...msg.org, jonghwa3.lee@...sung.com, rongjun.ying@....com,
	linux@...ck-us.net, devicetree@...r.kernel.org,
	linux-doc@...r.kernel.org, linux-kernel@...r.kernel.org,
	patches@...nsource.wolfsonmicro.com, linux-usb@...r.kernel.org,
	linux-omap@...r.kernel.org, aaro.koskinen@....fi,
	m.szyprowski@...sung.com, t.figa@...sung.com,
	Lee Jones <lee.jones@...aro.org>
Subject: Re: [PATCH v2 01/13] Documentation: add extcon devicetree bindings

On Fri, Apr 25, 2014 at 03:19:59PM +0200, Robert Baldyga wrote:
> On 04/22/2014 09:51 PM, Mark Brown wrote:

> >>  .../devicetree/bindings/extcon/extcon-adc-jack.txt |   60 +++++++++++++++++++
> >>  .../devicetree/bindings/extcon/extcon-arizona.txt  |   47 +++++++++++++++
> >>  .../devicetree/bindings/extcon/extcon-bindings.txt |   36 +++++++++++
> >>  .../devicetree/bindings/extcon/extcon-gpio.txt     |   63 ++++++++++++++++++++
> >>  .../devicetree/bindings/extcon/extcon-max14577.txt |   49 +++++++++++++++
> >>  .../devicetree/bindings/extcon/extcon-max77693.txt |   56 +++++++++++++++++
> >>  .../devicetree/bindings/extcon/extcon-max8997.txt  |   49 +++++++++++++++
> >>  .../devicetree/bindings/extcon/extcon-palmas.txt   |   37 ++++++++++--

> > This is creating device tree bindings for MFD components as devices when
> > those MFD components aren't well isolated from the rest of the device.
> > If we need to add extcon bindings the device should have the flexibility
> > to decide where to add the properties, and really things should be set
> > up so there's less duplication in the documentation.

> Those components has their own addresses on i2c bus, so they are,
> technically, separate devices, and they can (should?) be described by
> separate nodes. And I think it doesn't matter if they are grouped in one
> chip.

That's definitely not true for the arizona devices, I haven't
specifically checked for any of the others.  It's all one device and the
isolation isn't particularly solid.

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