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Message-Id: <1404472432-24764-1-git-send-email-peter.griffin@linaro.org> Date: Fri, 4 Jul 2014 12:13:49 +0100 From: Peter Griffin <peter.griffin@...aro.org> To: linux-arm-kernel@...ts.infradead.org, linux-kernel@...r.kernel.org, maxime.coquelin@...com, patrice.chotard@...com, srinivas.kandagatla@...il.com, devicetree@...r.kernel.org, balbi@...com, linux-usb@...r.kernel.org, linux-omap@...r.kernel.org Cc: peter.griffin@...aro.org, lee.jones@...aro.org Subject: [PATCH 0/3] Add ST dwc3 glue layer driver. This series adds support for the ST glue logic to manage the DWC3 HC on STiH407 SoC family chipsets. Peter Griffin (3): usb: dwc3: add ST dwc3 glue layer to manage dwc3 HC ARM: dts: sti: Add st-dwc3 devicetree bindings documentation MAINTAINERS: Add dwc3-st.c file to ARCH/STI architecture Documentation/devicetree/bindings/usb/dwc3-st.txt | 58 ++++ MAINTAINERS | 1 + drivers/usb/dwc3/Kconfig | 9 + drivers/usb/dwc3/Makefile | 1 + drivers/usb/dwc3/dwc3-st.c | 325 ++++++++++++++++++++++ 5 files changed, 394 insertions(+) create mode 100644 Documentation/devicetree/bindings/usb/dwc3-st.txt create mode 100644 drivers/usb/dwc3/dwc3-st.c -- 1.9.1 -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majordomo@...r.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/
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