linux-kernel - [PATCH v2 0/3] Add ST dwc3 glue layer driver.

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Date:	Sat,  5 Jul 2014 07:25:27 +0100
From:	Peter Griffin <peter.griffin@...aro.org>
To:	linux-arm-kernel@...ts.infradead.org, linux-kernel@...r.kernel.org,
	maxime.coquelin@...com, patrice.chotard@...com,
	srinivas.kandagatla@...il.com, devicetree@...r.kernel.org,
	balbi@...com, linux-usb@...r.kernel.org, linux-omap@...r.kernel.org
Cc:	peter.griffin@...aro.org, lee.jones@...aro.org,
	peppe.cavallaro@...com
Subject: [PATCH v2 0/3] Add ST dwc3 glue layer driver.

This series adds support for the ST glue logic to manage the DWC3 HC
on STiH407 SoC family chipsets.

Peter Griffin (3):
  usb: dwc3: add ST dwc3 glue layer to manage dwc3 HC
  ARM: dts: sti: Add st-dwc3 devicetree bindings documentation
  MAINTAINERS: Add dwc3-st.c file to ARCH/STI architecture

 Documentation/devicetree/bindings/usb/dwc3-st.txt |  58 ++++
 MAINTAINERS                                       |   1 +
 drivers/usb/dwc3/Kconfig                          |   9 +
 drivers/usb/dwc3/Makefile                         |   1 +
 drivers/usb/dwc3/dwc3-st.c                        | 325 ++++++++++++++++++++++
 5 files changed, 394 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/usb/dwc3-st.txt
 create mode 100644 drivers/usb/dwc3/dwc3-st.c

-- 
1.9.1

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