linux-kernel - Re: [PATCH v2 1/3] usb: dwc3: add ST dwc3 glue layer to manage dwc3 HC

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Message-ID: <20140722101544.GC8406@lee--X1>
Date:	Tue, 22 Jul 2014 11:15:44 +0100
From:	Lee Jones <lee.jones@...aro.org>
To:	Peter Griffin <peter.griffin@...aro.org>
Cc:	linux-arm-kernel@...ts.infradead.org, linux-kernel@...r.kernel.org,
	maxime.coquelin@...com, patrice.chotard@...com,
	srinivas.kandagatla@...il.com, devicetree@...r.kernel.org,
	balbi@...com, linux-usb@...r.kernel.org,
	linux-omap@...r.kernel.org, peppe.cavallaro@...com
Subject: Re: [PATCH v2 1/3] usb: dwc3: add ST dwc3 glue layer to manage dwc3
 HC

> Thanks for reviewing, see my comments inline below: -

In future, it's best to only reply to questions, or review comments
that you disagree with.  Anything that you will action or agree with
can be snipped along with any irrelevant code from your reply and
replaced with "<snip>" or "[...]".  If you are planning on actioning
everything and no not disagree with anything there's no need to reply
at all.

[...]

-- 
Lee Jones
Linaro STMicroelectronics Landing Team Lead
Linaro.org │ Open source software for ARM SoCs
Follow Linaro: Facebook | Twitter | Blog
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