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Message-ID: <20140918171809.GD14809@core.coreip.homeip.net>
Date:	Thu, 18 Sep 2014 10:18:12 -0700
From:	Dmitry Torokhov <dmitry.torokhov@...il.com>
To:	Tomeu Vizoso <tomeu@...euvizoso.net>
Cc:	Caesar Wang <caesar.wang@...k-chips.com>, heiko@...ech.de,
	rui.zhang@...el.com, edubezval@...il.com,
	Arnd Bergmann <arnd@...db.de>,
	"linux-kernel@...r.kernel.org" <linux-kernel@...r.kernel.org>,
	linux-pm@...r.kernel.org,
	"linux-arm-kernel@...ts.infradead.org" 
	<linux-arm-kernel@...ts.infradead.org>,
	"devicetree@...r.kernel.org" <devicetree@...r.kernel.org>,
	linux-doc@...r.kernel.org, huangtao@...k-chips.com,
	cf@...k-chips.com, dianders@...omium.org, addy.ke@...k-chips.com,
	zyf@...k-chips.com, cjf@...k-chips.com
Subject: Re: [PATCH v5 2/4] dt-bindings: document Rockchip thermal

On Thu, Sep 18, 2014 at 04:19:26PM +0200, Tomeu Vizoso wrote:
> On 18 September 2014 15:25, Caesar Wang <caesar.wang@...k-chips.com> wrote:
> > Tomeu,
> >
> > 在 2014年09月18日 17:27, Tomeu Vizoso 写道:
> >>
> >> On 17 September 2014 05:59, Caesar Wang <caesar.wang@...k-chips.com>
> >> wrote:
> >>>
> >>> This add the necessary binding documentation for the thermal
> >>> found on Rockchip SoCs
> >>
> >> Hi Caesar,
> >>
> >> is there any reason to not use the existing thermal bindings? You can
> >> find a description in
> >> Documentation/devicetree/bindings/thermal/thermal.txt and example code
> >> in omap, or in the patches for Tegra recently posted by Mikko
> >> Perttunen.
> >>
> >> Regards,
> >>
> >> Tomeu
> >
> >
> > Why should I use the existing thermal bindings?
> 
> Because otherwise, you are asking to merge duplicated code. There's a
> generic way to define thermal zones, trip points, cooling devices,
> etc. And also code to parse and plug them together. Why add
> soc-specific code to do the same?
> 
> > I believe omap,tegar and rockchip are  the three seperate thermals driver.
> 
> Yes, and OMAP is already using the generic bindings, and the proposed
> patches for Tegra as well, and I think it would make sense for
> Rockchip to also use them (unless I'm missing something).

You are talking about drivers/thermal/of-thermal.c, right? Yes, I think
Rockchip should be using the same generic framework if possible.

Thanks.

-- 
Dmitry
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