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Date: Mon, 9 Feb 2015 17:34:03 -0400 From: Eduardo Valentin <edubezval@...il.com> To: Rui Zhang <rui.zhang@...el.com>, ezequiel.garcia@...e-electrons.com, amit.kachhap@...aro.org, viresh.kumar@...aro.org, amit.daniel@...sung.com, hongbo.zhang@...aro.com, andrew@...n.ch, durgadoss.r@...el.com, peter@...e.net, shawn.guo@...aro.org, aaron.lu@...el.com, caesar.wang@...k-chips.com, b.zolnierkie@...sung.com, l.majewski@...sung.com, vincenzo.frascino@...com, mperttunen@...dia.com, mikko.perttunen@...si.fi, srinivas.pandruvada@...ux.intel.com, jacob.jun.pan@...ux.intel.com, bcousson@...libre.com Cc: LKML <linux-kernel@...r.kernel.org>, Linux PM <linux-pm@...r.kernel.org>, Eduardo Valentin <edubezval@...il.com> Subject: [PATCH RFC 02/12] Documentation: thermal docbook: add glossary This change introduces a section in the Introduction Chapter to list concepts used by the Thermal Framework. Signed-off-by: Eduardo Valentin <edubezval@...il.com> --- Documentation/DocBook/thermal.tmpl | 129 ++++++++++++++++++++++++++++++++++++- 1 file changed, 128 insertions(+), 1 deletion(-) diff --git a/Documentation/DocBook/thermal.tmpl b/Documentation/DocBook/thermal.tmpl index f8fb8a2..66efed3 100644 --- a/Documentation/DocBook/thermal.tmpl +++ b/Documentation/DocBook/thermal.tmpl @@ -84,5 +84,132 @@ devices. </para> - </chapter> + <sect1 id="glossary"> + <title>Glossary</title> + <para>The Linux Kernel Thermal Framework uses a + specific terminology to represent the entities involved + in thermal constrained environments. This section + summaries the terminology as dictionary. These terms are + in use within the present document and in the source + code of the Linux Kernel Thermal Framework. + </para> + <glossary> + <glossentry> + <glossterm>Thermal Zone</glossterm> + <glossdef> + <para>Thermal zones represent + what is the current status of a + thermal constrained zone in the + hardware. The zone usually is a + device or component. The status + of a thermal zone is mainly with + respect to temperature. + Currently, the Linux Kernel + Thermal Framework represents + temperature in miliCelsius. The + current abstraction covers for + non negative temperatures and + constraints. + </para> + </glossdef> + </glossentry> + <glossentry> + <glossterm>Thermal Sensors</glossterm> + <glossdef> + <para>Thermal sensors provide + temperature sensing capabilities + on thermal zones. Typical + devices are I2C ADC converters + and bandgaps. These are nodes + providing temperature data to + thermal zones. Thermal sensor + devices may control one or more + internal sensors. + </para> + </glossdef> + </glossentry> + <glossentry> + <glossterm>Trips Points</glossterm> + <glossdef> + <para>The trip node describes a + point in the temperature domain + in which the system takes an + action. This item describes just + the point, not the action. Trip + points are represented as + temperature in miliCelsius. The + current abstraction covers for + non negative temperatures. + </para> + </glossdef> + </glossentry> + <glossentry> + <glossterm>Thermal Governor</glossterm> + <glossdef> + <para>Thermal Governors + represent a policy to manage the + thermal zone device temperature. + The governor targets to keep + temperature in an acceptable + range which correlates to the + power budget, while maximizing + the performance. Governors can + be implemented in Kernel Space + or in User Space. + </para> + </glossdef> + </glossentry> + <glossentry> + <glossterm>Thermal Cooling Device</glossterm> + <glossdef> + <para>Cooling devices provide + control on power dissipation. + There are essentially two ways + to provide control on power + dissipation. First is by means + of regulating device + performance, which is known as + passive cooling. A typical + passive cooling is a CPU that + has dynamic voltage and + frequency scaling (DVFS), and + uses lower frequencies as + cooling states. Second is by + means of activating devices in + order to remove the dissipated + heat, which is known as active + cooling, e.g. regulating fan + speeds. In both cases, cooling + devices shall have a way to + determine the state of cooling + in which the device is. + </para> + </glossdef> + </glossentry> + <glossentry> + <glossterm>Cooling State</glossterm> + <glossdef> + <para>Any cooling device has a + range of cooling states (i.e. + different levels of heat + dissipation). For example a + fan's cooling states correspond + to the different fan speeds + possible. Cooling states are + referred to by single unsigned + integers, where larger numbers + mean greater heat dissipation. + The precise set of cooling + states associated with a device + (as referred to be the + cooling-min-state and + cooling-max-state properties) + should be defined in a + particular device's binding. + </para> + </glossdef> + </glossentry> + </glossary> + </sect1> + </chapter> </book> -- 2.1.3 -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majordomo@...r.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/
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