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Message-ID: <20150320060653.GC18907@leoy-linaro>
Date: Fri, 20 Mar 2015 14:06:53 +0800
From: Leo Yan <leo.yan@...aro.org>
To: Mark Rutland <mark.rutland@....com>
Cc: kongxinwei <kong.kongxinwei@...ilicon.com>,
"devicetree@...r.kernel.org" <devicetree@...r.kernel.org>,
"linux-pm@...r.kernel.org" <linux-pm@...r.kernel.org>,
"linuxarm@...wei.com" <linuxarm@...wei.com>,
"xuwei5@...ilicon.com" <xuwei5@...ilicon.com>,
"linux-kernel@...r.kernel.org" <linux-kernel@...r.kernel.org>,
"edubezval@...il.com" <edubezval@...il.com>,
"rui.zhuang@...el.com" <rui.zhuang@...el.com>,
"liguozhu@...ilicon.com" <liguozhu@...ilicon.com>,
"linux-arm-kernel@...ts.infradead.org"
<linux-arm-kernel@...ts.infradead.org>
Subject: Re: [PATCH 1/3] thermal: hisilicon: add new hisilicon thermal sensor
driver
hi Mark,
Thanks for reviewing, pls see below questions.
On Thu, Mar 19, 2015 at 02:17:53PM +0000, Mark Rutland wrote:
> On Thu, Mar 19, 2015 at 07:57:27AM +0000, kongxinwei wrote:
> > This patch adds the support for hisilicon thermal sensor, within
> > hisilicon SoC. there will register sensors for thermal framework
> > and use device tree to bind cooling device.
> >
> > Signed-off-by: Leo Yan <leo.yan@...aro.org>
> > Signed-off-by: kongxinwei <kong.kongxinwei@...ilicon.com>
> > ---
> > drivers/thermal/Kconfig | 8 +
> > drivers/thermal/Makefile | 1 +
> > drivers/thermal/hisi_thermal.c | 531 +++++++++++++++++++++++++++++++++++++++++
> > 3 files changed, 540 insertions(+)
> > create mode 100644 drivers/thermal/hisi_thermal.c
[...]
> > + ret = of_property_read_u32(np, "hisilicon,tsensor-thres-temp",
> > + &sensor->thres_temp);
> > + if (ret) {
> > + dev_err(&pdev->dev, "failed to get thres value %d: %d\n",
> > + index, ret);
> > + return ret;
> > + }
> > +
> > + ret = of_property_read_u32(np, "hisilicon,tsensor-reset-temp",
> > + &sensor->reset_temp);
> > + if (ret) {
> > + dev_err(&pdev->dev, "failed to get reset value %d: %d\n",
> > + index, ret);
> > + return ret;
> > + }
>
> I see now that these properties result in the HW being programmed. You
> should figure out how to reconcile these with thermal-zone trip points
> rather than having parallel properties.
Set "tsensor-thres-temp" to register so that if thermal reaches the
threshold, the sensor will trigger h/w interrupt.
Set "tsensor-reset-temp" to register so that if thermal reaches the
reset value, the sensor will assert SoC reset signal to trigger h/w
reset.
This is different w/t thermal-zone trip points, the trip points are
used for timer polling. Do u think below modification is more
reasonable?
- Set "tsensor-thres-temp" = 700000, which equal to thermal-zone
passive trip point, so that we can use h/w interrupt to update the
thermal value immediately, rather than using polling method w/t long
delay;
- Set "tsensor-reset-temp" = <100000>, which is higher than
thermal-zone critical trip point, so that the s/w reset method has
higher priority than h/w reset; we also can easily know the reset is
caused by thermal framework; "tsensor-reset-temp" is only used to
protect h/w circuit.
tsensor: tsensor@0,f7030700 {
acpu1_sensor {
hisilicon,tsensor-id = <1>;
hisilicon,tsensor-lag-value = <10>;
hisilicon,tsensor-thres-temp = <70000>;
hisilicon,tsensor-reset-temp = <100000>;
};
};
thermal-zones {
...
cluster1: cluster1 {
polling-delay-passive = <1000>; /* milliseconds */
polling-delay = <5000>; /* milliseconds */
/* sensor ID */
thermal-sensors = <&tsensor 1>;
trips {
cluster1_alert: cluster1_alert {
temperature = <70000>; /* millicelsius */
hysteresis = <2000>; /* millicelsius */
type = "passive";
};
cluster1_crit: cluster1_crit {
temperature = <90000>; /* millicelsius */
hysteresis = <2000>; /* millicelsius */
type = "critical";
};
};
};
> > +
> > + if (of_property_read_bool(np, "hisilicon,tsensor-bind-irq")) {
> > +
> > + if (data->irq_bind_sensor != -1)
> > + dev_warn(&pdev->dev, "irq has bound to index %d\n",
> > + data->irq_bind_sensor);
> > +
> > + /* bind irq to this sensor */
> > + data->irq_bind_sensor = index;
> > + }
>
> I don't see why this should be specified in the DT. Why do you believe
> it should?
The thermal sensor module has four sensors, but have only one
interrupt signal; This interrupt can only be used by one sensor;
So want to use dts to bind the interrupt with one selected sensor.
> [...]
>
> > +static int hisi_thermal_probe(struct platform_device *pdev)
> > +{
> > + struct hisi_thermal_data *data;
> > + struct resource *res;
> > + int i;
> > + int ret;
> > +
> > + if (!cpufreq_get_current_driver()) {
> > + dev_dbg(&pdev->dev, "no cpufreq driver!");
> > + return -EPROBE_DEFER;
> > + }
>
> Surely we care about not burning out the board even if we don't have
> cpufreq?
>
> Is there any ordering guarantee between the probing of this driver and
> cpufreq?
Yes, here need binding the thermal sensor w/t cpu cooling device,
and cpu cooling device is based on cpufreq driver.
Thanks,
Leo Yan
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