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Message-ID: <897A4C3B-DF7E-4AEE-A117-00CCB510F4DD@jic23.retrosnub.co.uk>
Date: Tue, 04 Aug 2015 17:52:17 +0100
From: Jonathan Cameron <jic23@...23.retrosnub.co.uk>
To: Matt Porter <mporter@...sulko.com>,
Linux IIO List <linux-iio@...r.kernel.org>,
Devicetree List <devicetree@...r.kernel.org>
CC: Jonathan Cameron <jic23@...nel.org>,
Rob Herring <robh+dt@...nel.org>,
Mark Rutland <mark.rutland@....com>,
Linux Kernel Mailing List <linux-kernel@...r.kernel.org>
Subject: Re: [PATCH 0/3] MAX6675 IIO temperature driver
On 3 August 2015 21:56:47 BST, Matt Porter <mporter@...sulko.com> wrote:
>This series adds a driver for the MAX6675 SPI thermocouple converter.
>The device supports temperature measurements via type-K thermocouples
>and implements cold-junction compensation within the part. The
>datasheet
>can be found at http://datasheets.maximintegrated.com/en/ds/MAX6675.pdf
For a device like this where perhaps it's position wrt iio/hwmon boundary is unclear
I want to see an argument for why IIO makes more sense in the cover letter + cc
at least the hwmon MAINTAINERS if not the list...
>
>Matt Porter (3):
> iio: temperature: add max6675 dt binding
> iio: temperature: add max6675 thermocouple converter driver
> MAINTAINERS: add max6675 driver
>
> .../bindings/iio/temperature/max6675.txt | 19 +++
> MAINTAINERS | 7 +
> drivers/iio/temperature/Kconfig | 11 ++
> drivers/iio/temperature/Makefile | 1 +
>drivers/iio/temperature/max6675.c | 155
>+++++++++++++++++++++
> 5 files changed, 193 insertions(+)
>create mode 100644
>Documentation/devicetree/bindings/iio/temperature/max6675.txt
> create mode 100644 drivers/iio/temperature/max6675.c
--
Sent from my Android device with K-9 Mail. Please excuse my brevity.
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