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Message-ID: <55ED59EB.4010000@osg.samsung.com>
Date: Mon, 7 Sep 2015 11:33:31 +0200
From: Javier Martinez Canillas <javier@....samsung.com>
To: Sjoerd Simons <sjoerd.simons@...labora.co.uk>,
linux-rockchip@...ts.infradead.org
Cc: linux-arm-kernel@...ts.infradead.org,
Heiko Stuebner <heiko@...ech.de>,
Kukjin Kim <kgene@...nel.org>,
Krzysztof Kozlowski <k.kozlowski@...sung.com>,
Thierry Reding <treding@...dia.com>,
Geert Uytterhoeven <geert+renesas@...der.be>,
linux-kernel@...r.kernel.org,
Russell King <linux@....linux.org.uk>,
Alexandre Belloni <alexandre.belloni@...e-electrons.com>,
Arnd Bergmann <arnd@...db.de>,
Lee Jones <lee.jones@...aro.org>,
Olof Johansson <olof@...om.net>, Ray Jui <rjui@...adcom.com>,
Stephen Warren <swarren@...dia.com>
Subject: Re: [PATCH 4/4] ARM: multi_v7_defconfig: Enable DW USB2 support and
rockchip phy
Hello Sjoerd,
On 09/06/2015 10:16 PM, Sjoerd Simons wrote:
> The DesignWare HS OTG USB 2.0 is used in various SoC families among wich
> the various rockchip SoCs, enable the driver and the PHY glue for
> rockchip
>
> Signed-off-by: Sjoerd Simons <sjoerd.simons@...labora.co.uk>
>
> ---
>
> arch/arm/configs/multi_v7_defconfig | 2 ++
> 1 file changed, 2 insertions(+)
>
> diff --git a/arch/arm/configs/multi_v7_defconfig b/arch/arm/configs/multi_v7_defconfig
> index fb673e2..49c733a 100644
> --- a/arch/arm/configs/multi_v7_defconfig
> +++ b/arch/arm/configs/multi_v7_defconfig
> @@ -514,6 +514,7 @@ CONFIG_USB_STORAGE=y
> CONFIG_USB_DWC3=y
> CONFIG_USB_CHIPIDEA=y
> CONFIG_USB_CHIPIDEA_HOST=y
> +CONFIG_USB_DWC2=y
> CONFIG_AB8500_USB=y
> CONFIG_KEYSTONE_USB_PHY=y
> CONFIG_OMAP_USB3=y
> @@ -658,6 +659,7 @@ CONFIG_PHY_HIX5HD2_SATA=y
> CONFIG_PWM_STI=m
> CONFIG_OMAP_USB2=y
> CONFIG_TI_PIPE3=y
> +CONFIG_PHY_ROCKCHIP_USB=y
> CONFIG_PHY_MIPHY28LP=y
> CONFIG_PHY_MIPHY365X=y
> CONFIG_PHY_RCAR_GEN2=m
>
After dropping the DWC2 and keeping only the PHY as suggested
by Heiko and Krzysztof:
Reviewed-by: Javier Martinez Canillas <javier@....samsung.com>
Best regards,
--
Javier Martinez Canillas
Open Source Group
Samsung Research America
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