linux-kernel - Re: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model

lists.openwall.net		lists / announce owl-users owl-dev john-users john-dev passwdqc-users yescrypt popa3d-users / oss-security kernel-hardening musl sabotage tlsify passwords / crypt-dev xvendor / Bugtraq Full-Disclosure linux-kernel linux-netdev linux-ext4 linux-hardening linux-cve-announce PHC
Open Source and information security mailing list archives

Hash Suite: Windows password security audit tool. GUI, reports in PDF.

[<prev] [next>] [<thread-prev] [thread-next>] [day] [month] [year] [list]

Message-ID: <20151028154449.GH3716@ubuntu>
Date:	Wed, 28 Oct 2015 21:14:49 +0530
From:	Viresh Kumar <viresh.kumar@...aro.org>
To:	Dawei Chien <dawei.chien@...iatek.com>
Cc:	"Rafael J. Wysocki" <rjw@...ysocki.net>,
	Rob Herring <robh+dt@...nel.org>,
	Pawel Moll <pawel.moll@....com>,
	Mark Rutland <mark.rutland@....com>,
	Ian Campbell <ijc+devicetree@...lion.org.uk>,
	Kumar Gala <galak@...eaurora.org>,
	Matthias Brugger <matthias.bgg@...il.com>,
	Daniel Kurtz <djkurtz@...omium.org>,
	Sascha Hauer <s.hauer@...gutronix.de>,
	Daniel Lezcano <daniel.lezcano@...aro.org>,
	devicetree@...r.kernel.org, linux-arm-kernel@...ts.infradead.org,
	linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org,
	linux-mediatek@...ts.infradead.org, srv_heupstream@...iatek.com,
	Sascha Hauer <kernel@...gutronix.de>
Subject: Re: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model

On 22-10-15, 20:02, Dawei Chien wrote:
> Use Intelligent Power Allocation (IPA) technical to add static/dynamic power model for binding CPU thermal zone.
> The power allocator governor allocates power budget to control CPU temperature.
> 
> Power Allocator governor is able to keep SOC temperature within a defined temperature range to avoid SOC overheat and keep it's performance. mt8173-cpufreq.c need to register its' own power model with power allocator thermal governor, so that power allocator governor can allocates suitable power budget to control CPU temperature.
> 
> PATCH1 is base on
> https://patchwork.kernel.org/patch/7034601/
> 
> PATCH2 is base on Sascha's thermal driver V9
> https://patchwork.kernel.org/patch/7249821/
> https://patchwork.kernel.org/patch/7249861/
> https://patchwork.kernel.org/patch/7249891/
> 
> Change since V1:
> include mt8171.h and sort header file for mt8173.dtsi
> 
> Change since V2:
> Move dynamic/static power model in device tree
> 
> Dawei.Chien (2):
>   thermal: mediatek: Add cpu power cooling model.
>   arm64: dts: mt8173: Add thermal zone node for mt8173.

Sorry for being extremely late in reviewing this stuff. You are
already on v3 and I haven't reviewed it once. Mostly due to bad timing
of my holidays and other work pressure.

Now, there are few things that I feel are not properly addressed here,
and I may be wrong:
- Where are the bindings for static-power-points and
  dynamic-power-coefficient. Sorry I failed to see them in this or
  other series you mentioned.
- Even then, why should we be adding another table into DT for
  voltage/power ? And not reuse and extend the opp-v2 stuff which is
  already mainlined now.
- There are few issues with the code as well, but I want to see where
  the bindings should go first. And then only discuss the code
  further.

-- 
viresh
--
To unsubscribe from this list: send the line "unsubscribe linux-kernel" in
the body of a message to majordomo@...r.kernel.org
More majordomo info at  http://vger.kernel.org/majordomo-info.html
Please read the FAQ at  http://www.tux.org/lkml/