linux-kernel - Re: [PATCH v4 0/3] Dynamic power model from device tree

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Date:	Tue, 17 Nov 2015 10:05:53 +0530
From:	Viresh Kumar <viresh.kumar@...aro.org>
To:	Punit Agrawal <punit.agrawal@....com>,
	"Rafael J. Wysocki" <rjw@...ysocki.net>
Cc:	"devicetree@...r.kernel.org" <devicetree@...r.kernel.org>,
	Linux PM list <linux-pm@...r.kernel.org>,
	"linux-kernel@...r.kernel.org" <linux-kernel@...r.kernel.org>,
	Eduardo Valentin <edubezval@...il.com>,
	dawei.chien@...iatek.com, Javi Merino <javi.merino@....com>
Subject: Re: [PATCH v4 0/3] Dynamic power model from device tree

On Tue, Nov 17, 2015 at 1:00 AM, Punit Agrawal <punit.agrawal@....com> wrote:
> Hi,
>
> This patchset adds support to build a single-coefficient dynamic power
> model for a CPU. The model is used by the CPU cooling device to
> provide an estimate of power consumption and also translate allocated
> power to performance cap.
>
> Changes from previous posting -
>
> v3 -> v4:
> arm_big_little: Migrated to using static arrays
> arm_big_little: Updated Kconfig to support building thermal as module
>
> Patch 1 extends the CPU nodes binding to provide an optional dynamic
> power coefficient which can be used to create a dynamic power model
> for the CPUs. This model is used to constrain device power consumption
> (using power_allocator governor) when the system is thermally
> constrained.
>
> Patches 2-3 extends the cpufreq-dt and arm_big_little driver to
> register cpu cooling devices with the dynamic coefficient when
> provided.
>
> The patches were previously posted at [0][1][2]. Mediatek platform
> 8173 builds on these bindings to build the power model.
>
> If there are no objections, I'd appreciate Acks from device tree
> bindings maintainers.

You forgot to cc cpufreq maintainers for this and there are good chances
that I may completely miss the series some times..
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