lists.openwall.net   lists  /  announce  owl-users  owl-dev  john-users  john-dev  passwdqc-users  yescrypt  popa3d-users  /  oss-security  kernel-hardening  musl  sabotage  tlsify  passwords  /  crypt-dev  xvendor  /  Bugtraq  Full-Disclosure  linux-kernel  linux-netdev  linux-ext4  linux-hardening  linux-cve-announce  PHC 
Open Source and information security mailing list archives
 
Hash Suite: Windows password security audit tool. GUI, reports in PDF.
[<prev] [next>] [thread-next>] [day] [month] [year] [list]
Message-ID: <1458029437-12846-1-git-send-email-dawei.chien@mediatek.com>
Date:	Tue, 15 Mar 2016 16:10:34 +0800
From:	Dawei Chien <dawei.chien@...iatek.com>
To:	Viresh Kumar <viresh.kumar@...aro.org>,
	"Rafael J. Wysocki" <rjw@...ysocki.net>,
	Matthias Brugger <matthias.bgg@...il.com>
CC:	Rob Herring <robh+dt@...nel.org>, Pawel Moll <pawel.moll@....com>,
	Mark Rutland <mark.rutland@....com>,
	Ian Campbell <ijc+devicetree@...lion.org.uk>,
	Kumar Gala <galak@...eaurora.org>,
	Daniel Kurtz <djkurtz@...omium.org>,
	Sascha Hauer <s.hauer@...gutronix.de>,
	Daniel Lezcano <daniel.lezcano@...aro.org>,
	Dawei Chien <dawei.chien@...iatek.com>,
	<devicetree@...r.kernel.org>,
	<linux-arm-kernel@...ts.infradead.org>,
	<linux-kernel@...r.kernel.org>, <linux-pm@...r.kernel.org>,
	<linux-mediatek@...ts.infradead.org>,
	<srv_heupstream@...iatek.com>,
	Sascha Hauer <kernel@...gutronix.de>,
	Punit Agrawal <punit.agrawal@....com>
Subject: [RESEND][PATCH v6 0/3] thermal: mediatek: Add cpu dynamic power cooling model.

Use Intelligent Power Allocation (IPA) technical to add dynamic power model for binding CPU thermal zone. The power allocator governor allocates power budget to control CPU temperature.

Power Allocator governor is able to keep SOC temperature within a defined temperature range to avoid SOC overheat and keep it's performance.
mt8173-cpufreq.c need to register its' own power model with power allocator thermal governor, so that power allocator governor can allocates suitable power budget to control CPU temperature.

Binding document is refer to this patchset
https://lkml.org/lkml/2015/11/30/239

Change since V5:
1. Remove thermal sensor ID from phandles

Change since V4:
1. Remove unnecessary error-checking for mt8173-cpufreq.c 2. Initializing variable capacitance with 0

Change since V3:
1. Remove static power model
2. Split V3's device tree in two for thermal zones and dynamic power models respectively

Change since V2:
1. Move dynamic/static power model in device tree

Change since V1:
1. Include mt8171.h and sort header file for mt8173.dtsi

Dawei Chien (3):
  thermal: mediatek: Add cpu dynamic power cooling model.
  arm64: dts: mt8173: Add thermal zone node.
  arm64: dts: mt8173: Add dynamic power node.

 arch/arm64/boot/dts/mediatek/mt8173.dtsi |   47 ++++++++++++++++++++++++++++++
 drivers/cpufreq/mt8173-cpufreq.c         |   12 ++++++--
 2 files changed, 57 insertions(+), 2 deletions(-)

Powered by blists - more mailing lists

Powered by Openwall GNU/*/Linux Powered by OpenVZ