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Message-ID: <1481608086.2083.1.camel@intel.com>
Date: Tue, 13 Dec 2016 13:48:06 +0800
From: Zhang Rui <rui.zhang@...el.com>
To: Linus Torvalds <torvalds@...ux-foundation.org>
Cc: Linux PM list <linux-pm@...r.kernel.org>,
LKML <linux-kernel@...r.kernel.org>,
Eduardo Valentin <edubezval@...il.com>
Subject: [GIT PULL] Thermal management updates for v4.10-rc1
Hi, Linus,
Please pull from
git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux.git next
to receive the latest Thermal Management updates for v4.10-rc1 with
top-most commit 0faf7dd5a947006978b549dfe29a01b710becf4a:
MAINTAINERS: Samsung: Update maintainer for PWM FAN and SAMSUNG
THERMAL (2016-12-13 11:20:23 +0800)
on top of commit 23400ac997062647f2b63c82030d189671b1effe:
Merge branch 'for-rc' of
git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux (2016-11-22
13:53:01 -0800)
Specifics:
- Thermal core code reorganization and cleanup. Two new files are
created for thermal sysfs I/F code and thermal helper functions.
From: Eduardo Valentin.
- Sanitize hotplug and locking for x86_pkg_temp driver.
From: Thomas Gleixner.
- Update MAINTAINER file for pwm-fan driver and Samsung thermal driver.
From: Lukasz Majewski.
- Fix module auto-load for max77620, tango and db8500 thermal driver.
From: Javier Martinez Canillas.
- Fix a bug that thermal hwmon sysfs I/F returns wrong critical trip
point temperature value. From: Krzysztof Kozlowski.
- Add Skylake PCH 100 series support for intel_pch_thermal driver.
From: OGAWA Hirofumi.
- Small fixes and cleanups for platform thermal drivers.
From Julia Lawall, Luis Henriques, Leo Yan, Stephen Boyd,
Shawn Lin, Javi Merino and Lukasz Luba.
thanks,
rui
----------------------------------------------------------------
Eduardo Valentin (49):
thermal: core: prevent zones with no types to be registered
thermal: core: group thermal_zone DEVICE_ATTR's declarations
thermal: core: group device_create_file() calls that are always
created
thermal: core: use dev.groups to manage always present tz
attributes
thermal: core: move emul_temp creation to tz->device.groups
thermal: core: move mode attribute to tz->device.groups
thermal: core: move passive attr to tz->device.groups
thermal: core: improve power actor documentation
thermal: core: move power actor code out of sysfs I/F section
thermal: core: remove useless empty line
thermal: core: fix style on remove_trip_attrs()
thermal: core: move the trip attrs to the tz sysfs I/F section
thermal: core: create tz->device.groups dynamically
thermal: core: move trips attributes to tz->device.groups
thermal: core: remove unnecessary device_remove() calls
thermal: core: split passive_store
thermal: core: split policy_store
thermal: core: split available_policies_show()
thermal: core: move to_thermal_zone() macro to header file
thermal: core: treat correctly the return value of *scanf calls
thermal: core: match parenthesis on code alignment
thermal: core: move thermal_zone sysfs to thermal_sysfs.c
thermal: core: move to_cooling_device macro to header file
thermal: core: move cooling device sysfs to thermal_sysfs.c
thermal: core: remove a couple of style issues on helpers
thermal: core: introduce thermal_helpers.c
thermal: core: group functions related to governor handling
thermal: core: move idr handling to device management section
thermal: core: small style fix on __unbind() helper
thermal: core: move __unbind() helper to where it is used
thermal: core: move bind_cdev() to where it is used
thermal: core: move bind_tz() to where it is used
thermal: core: fix couple of style issues on __bind() helper
thermal: core: move __bind() to where it is used
thermal: core: add inline to print_bind_err_msg()
thermal: core: move notify to the zone update section
thermal: core: add a comment describing the main update loop
thermal: core: add a comment describing the power actor section
thermal: core: add a comment describing the device management
section
thermal: sysfs: remove symbols of emul_temp when config is
disabled
thermal: core: remove FSF address in the GPL notice
thermal: core: small style fix when checking for
__find_governor()
thermal: core: standardize line breaking alignment
thermal: core: remove void function return statements
thermal: core: remove style warnings and checks
thermal: core: improve kerneldoc entry of
thermal_cooling_device_unregister
thermal: core: use kzalloc(sizeof(*ptr),...)
thermal: sysfs: use kcalloc() instead of kzalloc()
thermal: core: move slop and offset helpers to thermal_helpers.c
Javi Merino (1):
devfreq_cooling: pass a pointer to devfreq in the power model
callbacks
Javier Martinez Canillas (3):
thermal: max77620: Fix module autoload
thermal: tango: Fix module autoload
thermal: db8500: Fix module autoload
Julia Lawall (2):
thermal: hwmon: use permission-specific DEVICE_ATTR variants
thermal: int340x_thermal: use permission-specific DEVICE_ATTR
variants
Krzysztof Kozlowski (1):
thermal: hwmon: Properly report critical temperature in sysfs
Leo Yan (1):
thermal: hisilicon: fix for dependency
Luis Henriques (1):
thermal: ti-soc-thermal: add missing clk_put()
Lukasz Luba (1):
devfreq_cooling: make the structs devfreq_cooling_xxx visible for
all
Lukasz Majewski (1):
MAINTAINERS: Samsung: Update maintainer for PWM FAN and SAMSUNG
THERMAL
OGAWA Hirofumi (1):
thermal: intel_pch_thermal: Support skylake PCH 100 series
thermal
Sebastian Andrzej Siewior (1):
thermal/x86 pkg temp: Convert to hotplug state machine
Shawn Lin (2):
thermal: rockchip: improve the warning log
dt-bindings: rockchip-thermal: fix the misleading description
Stephen Boyd (1):
thermal: qcom-spmi: Treat reg property as a single cell
Thomas Gleixner (11):
thermal/x86_pkg_temp: Cleanup thermal interrupt handling
thermal/x86_pkg_temp: Remove redundant package search
thermal/x86_pkg_temp: Replace open coded cpu search
thermal/x86_pkg_temp: Sanitize callback (de)initialization
thermal/x86_pkg_temp: Get rid of ref counting
thermal/x86_pkg_temp: Cleanup namespace
thermal/x86_pkg_temp: Cleanup code some more
thermal/x86_pkg_temp: Sanitize locking
thermal/x86_pkg_temp: Move work scheduled flag into package
struct
thermal/x86_pkg_temp: Move work into package struct
thermal/x86_pkg_temp: Sanitize package management
Zhang Rui (1):
Merge branches 'thermal-core', 'thermal-intel', 'thermal-soc-
fixes' and 'thermal-reorg' into next
.../bindings/thermal/rockchip-thermal.txt | 3 +
MAINTAINERS | 4 +-
drivers/thermal/Kconfig | 4 +-
drivers/thermal/Makefile | 3 +-
drivers/thermal/db8500_thermal.c | 1 +
drivers/thermal/devfreq_cooling.c | 5 +-
drivers/thermal/int340x_thermal/int3400_thermal.c | 2 +-
drivers/thermal/intel_pch_thermal.c | 64 +-
drivers/thermal/max77620_thermal.c | 1 +
drivers/thermal/qcom-spmi-temp-alarm.c | 6 +-
drivers/thermal/rockchip_thermal.c | 7 +-
drivers/thermal/tango_thermal.c | 1 +
drivers/thermal/thermal_core.c | 1446 +++++-------
--------
drivers/thermal/thermal_core.h | 26 +
drivers/thermal/thermal_helpers.c | 226 +++
drivers/thermal/thermal_hwmon.c | 4 +-
drivers/thermal/thermal_sysfs.c | 771 +++++++++++
drivers/thermal/ti-soc-thermal/ti-bandgap.c | 5 +-
drivers/thermal/x86_pkg_temp_thermal.c | 587 ++++----
include/linux/devfreq_cooling.h | 9 +-
include/linux/thermal.h | 2 +
21 files changed, 1650 insertions(+), 1527 deletions(-)
create mode 100644 drivers/thermal/thermal_helpers.c
create mode 100644 drivers/thermal/thermal_sysfs.c
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