linux-kernel - RE: [Patch v2 1/3] dt-bindings: Document the hi3660 thermal sensor bindings

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Message-ID: <68C6844FB78C6946B9DB8EACE2D237B0985B5A3B@dggeml507-mbx.china.huawei.com>
Date:   Tue, 4 Jul 2017 11:03:22 +0000
From:   "Wangtao (Kevin, Kirin)" <kevin.wangtao@...ilicon.com>
To:     Eduardo Valentin <edubezval@...il.com>
CC:     "rui.zhang@...el.com" <rui.zhang@...el.com>,
        "robh+dt@...nel.org" <robh+dt@...nel.org>,
        "mark.rutland@....com" <mark.rutland@....com>,
        "xuwei (O)" <xuwei5@...ilicon.com>,
        "catalin.marinas@....com" <catalin.marinas@....com>,
        "will.deacon@....com" <will.deacon@....com>,
        "linux-pm@...r.kernel.org" <linux-pm@...r.kernel.org>,
        "devicetree@...r.kernel.org" <devicetree@...r.kernel.org>,
        "linux-kernel@...r.kernel.org" <linux-kernel@...r.kernel.org>,
        "linux-arm-kernel@...ts.infradead.org" 
        <linux-arm-kernel@...ts.infradead.org>,
        "Sunzhaosheng Sun(Zhaosheng)" <sunzhaosheng@...ilicon.com>,
        "leo.yan@...aro.org" <leo.yan@...aro.org>
Subject: RE: [Patch v2 1/3] dt-bindings: Document the hi3660 thermal sensor
 bindings


On 2017/7/1 11:06, "Eduardo Valentin" <edubezval@...il.com> wrote:
> 
> On Thu, Jun 22, 2017 at 11:42:01AM +0800, Tao Wang wrote:
> > This adds documentation of device tree bindings for the
> > thermal sensor controller of hi3660 SoC.
> >
> > Signed-off-by: Tao Wang <kevin.wangtao@...ilicon.com>
> > ---
> > Changes in v2:
> > - remove redundant property
> >
> >  .../devicetree/bindings/thermal/hi3660-thermal.txt |   16
> ++++++++++++++++
> >  1 file changed, 16 insertions(+)
> >  create mode 100644 Documentation/devicetree/bindings/thermal/hi3660-
> thermal.txt
> >
> > diff --git a/Documentation/devicetree/bindings/thermal/hi3660-
> thermal.txt b/Documentation/devicetree/bindings/thermal/hi3660-
> thermal.txt
> > new file mode 100644
> > index 0000000..f3dddcf
> > --- /dev/null
> > +++ b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
> > @@ -0,0 +1,16 @@
> > +* Temperature Sensor on hisilicon hi3660 SoC
> > +
> 
> Would you mind add some more description of the sensors/where to find
> further hardware documentation?
Sure,  documentation is on
https://github.com/96boards/documentation/blob/master/ConsumerEdition/HiKey960/HardwareDocs/HiKey960_SoC_Reference_Manual.pdf

> 
> > +** Required properties :
> > +
> > +- compatible: "hisilicon,thermal-hi3660".
> > +- reg: physical base address of thermal sensor and length of memory
> mapped
> > +  region.
> > +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
> > +
> > +Example :
> > +
> > +	tsensor: tsensor {
> > +		compatible = "hisilicon,thermal-hi3660";
> > +		reg = <0x0 0xfff30000 0x0 0x1000>;
> > +		#thermal-sensor-cells = <1>;
> > +	 };
> > --
> > 1.7.9.5
> >