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Message-ID: <CAGb2v677mjrwN5-0A0cxFQthkCOHqrSwQmAgXreBLo8oPWj14g@mail.gmail.com>
Date: Mon, 24 Jul 2017 14:07:08 +0800
From: Chen-Yu Tsai <wens@...e.org>
To: Icenowy Zheng <icenowy@...c.io>
Cc: Lee Jones <lee.jones@...aro.org>, Rob Herring <robh+dt@...nel.org>,
Maxime Ripard <maxime.ripard@...e-electrons.com>,
Chen-Yu Tsai <wens@...e.org>,
Jonathan Cameron <jic23@...nel.org>,
Quentin Schulz <quentin.schulz@...e-electrons.com>,
devicetree <devicetree@...r.kernel.org>,
linux-arm-kernel <linux-arm-kernel@...ts.infradead.org>,
linux-kernel <linux-kernel@...r.kernel.org>,
linux-iio@...r.kernel.org,
linux-sunxi <linux-sunxi@...glegroups.com>
Subject: Re: [linux-sunxi] [PATCH v3 4/5] ARM: sun8i: h3: add support for the
thermal sensor in H3
On Sun, Jul 23, 2017 at 10:13 PM, Icenowy Zheng <icenowy@...c.io> wrote:
> As we have gained the support for the thermal sensor in H3, we can now
> add its device nodes to the device tree.
>
> Add them to the H3 device tree.
>
> The H5 thermal sensor has some differences, and will be added furtherly.
>
> Signed-off-by: Icenowy Zheng <icenowy@...c.io>
Other than the possibility of referencing e-fuses for calibration data,
this patch looks good.
Reviewed-by: Chen-Yu Tsai <wens@...e.org>
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