linux-kernel - Re: [PATCH 7/9] dt-bindings: Document the hi3660 thermal sensor binding

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Date:   Tue, 3 Oct 2017 16:59:06 -0500
From:   Rob Herring <robh@...nel.org>
To:     Tao Wang <kevin.wangtao@...ilicon.com>
Cc:     rui.zhang@...el.com, edubezval@...il.com, mark.rutland@....com,
        xuwei5@...ilicon.com, catalin.marinas@....com, will.deacon@....com,
        leo.yan@...aro.org, lonela.Voinescu@....com,
        Valentin.Schneider@....com, vincent.guittot@...aro.org,
        daniel.lezcano@...aro.org, sunzhaosheng@...ilicon.com,
        gengyanping@...ilicon.com, linux-pm@...r.kernel.org,
        devicetree@...r.kernel.org, linux-kernel@...r.kernel.org,
        linux-arm-kernel@...ts.infradead.org,
        Kevin Wangtao <kevin.wangtao@...aro.org>
Subject: Re: [PATCH 7/9] dt-bindings: Document the hi3660 thermal sensor
 binding

On Fri, Sep 22, 2017 at 05:42:10PM +0800, Tao Wang wrote:
> From: Kevin Wangtao <kevin.wangtao@...aro.org>
> 
> This adds documentation of device tree bindings for the
> thermal sensor controller of hi3660 SoC.
> 
> Signed-off-by: Kevin Wangtao <kevin.wangtao@...aro.org>
> ---
>  Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt | 9 +++++++++
>  1 file changed, 9 insertions(+)

Acked-by: Rob Herring <robh@...nel.org>