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Date: Tue, 3 Oct 2017 16:59:06 -0500 From: Rob Herring <robh@...nel.org> To: Tao Wang <kevin.wangtao@...ilicon.com> Cc: rui.zhang@...el.com, edubezval@...il.com, mark.rutland@....com, xuwei5@...ilicon.com, catalin.marinas@....com, will.deacon@....com, leo.yan@...aro.org, lonela.Voinescu@....com, Valentin.Schneider@....com, vincent.guittot@...aro.org, daniel.lezcano@...aro.org, sunzhaosheng@...ilicon.com, gengyanping@...ilicon.com, linux-pm@...r.kernel.org, devicetree@...r.kernel.org, linux-kernel@...r.kernel.org, linux-arm-kernel@...ts.infradead.org, Kevin Wangtao <kevin.wangtao@...aro.org> Subject: Re: [PATCH 7/9] dt-bindings: Document the hi3660 thermal sensor binding On Fri, Sep 22, 2017 at 05:42:10PM +0800, Tao Wang wrote: > From: Kevin Wangtao <kevin.wangtao@...aro.org> > > This adds documentation of device tree bindings for the > thermal sensor controller of hi3660 SoC. > > Signed-off-by: Kevin Wangtao <kevin.wangtao@...aro.org> > --- > Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt | 9 +++++++++ > 1 file changed, 9 insertions(+) Acked-by: Rob Herring <robh@...nel.org>
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