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Message-ID: <20180126144334.27hengoucfipdsdj@flea.lan>
Date: Fri, 26 Jan 2018 15:43:34 +0100
From: Maxime Ripard <maxime.ripard@...e-electrons.com>
To: Icenowy Zheng <icenowy@...c.io>
Cc: linux-arm-kernel@...ts.infradead.org, devicetree@...r.kernel.org,
linux-sunxi@...glegroups.com, Marc Zyngier <marc.zyngier@....com>,
Linus Walleij <linus.walleij@...aro.org>,
Daniel Lezcano <daniel.lezcano@...aro.org>,
Russell King <linux@...linux.org.uk>,
linux-kernel@...r.kernel.org, linux-gpio@...r.kernel.org,
Chen-Yu Tsai <wens@...e.org>, linux-clk@...r.kernel.org
Subject: Re: [RFC PATCH 0/9] initial support for "suniv" Allwinner new ARM9
SoC
On Thu, Jan 25, 2018 at 11:38:04PM +0800, Icenowy Zheng wrote:
> >On Wed, Jan 24, 2018 at 09:10:34PM +0800, Icenowy Zheng wrote:
> >> 在 2018年1月22日星期一 CST 下午8:14:35,Maxime Ripard 写道:
> >> > On Sat, Jan 20, 2018 at 07:17:26AM +0800, Icenowy Zheng wrote:
> >> > > This is the RFC initial patchset for the "new" Allwinner SUNIV
> >ARM9 SoC.
> >> > >
> >> > > The same die is packaged differently, come with different
> >co-packaged
> >> > > DRAM or shipped with different SDK; and then made many model
> >names: F23,
> >> > > F25, F1C100A, F1C100S, F1C200S, F1C500, F1C600, R6, etc. These
> >SoCs all
> >> > > share a common feature set and are packaged similarly (eLQFP128
> >for SoCs
> >> > > without co-packaged DRAM, QFN88 for with DRAM). As their's no
> >> > > functionality hidden on the QFN88 models (except DRAM interface
> >not
> >> > > exported), it's not clever to differentiate them. So I will use
> >suniv as
> >> > > common name of all these SoCs.
> >> >
> >> > Where is that suniv prefix coming from?
> >>
> >> The BSP (Melis and Linux). (e.g. "libs/suniv" directory of the Melis
> >SDK and
> >> "arch/arm/boot/dts/sunivw1p1.dtsi" in the Linux SDK)
> >
> >Do you have a link to that BSP?
>
> I have it on the Baidu Pan. Is it acceptable?
Yep, it's not crazy fast but it works :)
Thanks!
Maxime
--
Maxime Ripard, Free Electrons
Embedded Linux and Kernel engineering
http://free-electrons.com
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