linux-kernel - Re: [PATCH v2 11/16] arm: dts: sunxi-h3-h5: add support for the thermal sensor in H3 and H5

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Message-ID: <20180129094918.4fvxpmoftgxxkqg3@flea.lan>
Date:   Mon, 29 Jan 2018 10:49:18 +0100
From:   Maxime Ripard <maxime.ripard@...e-electrons.com>
To:     Philipp Rossak <embed3d@...il.com>
Cc:     lee.jones@...aro.org, robh+dt@...nel.org, mark.rutland@....com,
        wens@...e.org, linux@...linux.org.uk, jic23@...nel.org,
        knaack.h@....de, lars@...afoo.de, pmeerw@...erw.net,
        davem@...emloft.net, hans.verkuil@...co.com, mchehab@...nel.org,
        rask@...melder.dk, clabbe.montjoie@...il.com, sean@...s.org,
        krzk@...nel.org, quentin.schulz@...e-electrons.com,
        icenowy@...c.io, edu.molinas@...il.com, singhalsimran0@...il.com,
        linux-iio@...r.kernel.org, devicetree@...r.kernel.org,
        linux-arm-kernel@...ts.infradead.org, linux-kernel@...r.kernel.org,
        linux-sunxi@...glegroups.com
Subject: Re: [PATCH v2 11/16] arm: dts: sunxi-h3-h5: add support for the
 thermal sensor in H3 and H5

Hi,

On Mon, Jan 29, 2018 at 12:29:14AM +0100, Philipp Rossak wrote:
> As we have gained the support for the thermal sensor in H3 and H5,
> we can now add its device nodes to the device tree. The H3 and H5 share
> most of its compatible. The compatible and the thermal sensor cells
> will be added in an additional patch per device.
> 
> Signed-off-by: Philipp Rossak <embed3d@...il.com>
> ---
>  arch/arm/boot/dts/sunxi-h3-h5.dtsi | 9 +++++++++
>  1 file changed, 9 insertions(+)
> 
> diff --git a/arch/arm/boot/dts/sunxi-h3-h5.dtsi b/arch/arm/boot/dts/sunxi-h3-h5.dtsi
> index 7a83b15225c7..413c789b588d 100644
> --- a/arch/arm/boot/dts/sunxi-h3-h5.dtsi
> +++ b/arch/arm/boot/dts/sunxi-h3-h5.dtsi
> @@ -426,6 +426,15 @@
>  			};
>  		};
>  
> +		ths: thermal-sensor@...5000 {
> +			reg = <0x01c25000 0x100>;

The size is 0x400

Maxime

-- 
Maxime Ripard, Free Electrons
Embedded Linux and Kernel engineering
http://free-electrons.com

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