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Message-ID: <afdf049d-c037-1e0e-359e-faa7a38730d9@gmail.com>
Date: Mon, 29 Jan 2018 12:54:26 +0100
From: Philipp Rossak <embed3d@...il.com>
To: Maxime Ripard <maxime.ripard@...e-electrons.com>
Cc: lee.jones@...aro.org, robh+dt@...nel.org, mark.rutland@....com,
wens@...e.org, linux@...linux.org.uk, jic23@...nel.org,
knaack.h@....de, lars@...afoo.de, pmeerw@...erw.net,
davem@...emloft.net, hans.verkuil@...co.com, mchehab@...nel.org,
rask@...melder.dk, clabbe.montjoie@...il.com, sean@...s.org,
krzk@...nel.org, quentin.schulz@...e-electrons.com,
icenowy@...c.io, edu.molinas@...il.com, singhalsimran0@...il.com,
linux-iio@...r.kernel.org, devicetree@...r.kernel.org,
linux-arm-kernel@...ts.infradead.org, linux-kernel@...r.kernel.org,
linux-sunxi@...glegroups.com
Subject: Re: [PATCH v2 11/16] arm: dts: sunxi-h3-h5: add support for the
thermal sensor in H3 and H5
On 29.01.2018 10:49, Maxime Ripard wrote:
> Hi,
>
> On Mon, Jan 29, 2018 at 12:29:14AM +0100, Philipp Rossak wrote:
>> As we have gained the support for the thermal sensor in H3 and H5,
>> we can now add its device nodes to the device tree. The H3 and H5 share
>> most of its compatible. The compatible and the thermal sensor cells
>> will be added in an additional patch per device.
>>
>> Signed-off-by: Philipp Rossak <embed3d@...il.com>
>> ---
>> arch/arm/boot/dts/sunxi-h3-h5.dtsi | 9 +++++++++
>> 1 file changed, 9 insertions(+)
>>
>> diff --git a/arch/arm/boot/dts/sunxi-h3-h5.dtsi b/arch/arm/boot/dts/sunxi-h3-h5.dtsi
>> index 7a83b15225c7..413c789b588d 100644
>> --- a/arch/arm/boot/dts/sunxi-h3-h5.dtsi
>> +++ b/arch/arm/boot/dts/sunxi-h3-h5.dtsi
>> @@ -426,6 +426,15 @@
>> };
>> };
>>
>> + ths: thermal-sensor@...5000 {
>> + reg = <0x01c25000 0x100>;
>
> The size is 0x400
>
> Maxime
>
Ok, I will fix this.
Philipp
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