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Message-ID: <20180207072606.GO28462@vireshk-i7>
Date: Wed, 7 Feb 2018 12:56:06 +0530
From: Viresh Kumar <viresh.kumar@...aro.org>
To: Daniel Lezcano <daniel.lezcano@...aro.org>
Cc: edubezval@...il.com, kevin.wangtao@...aro.org, leo.yan@...aro.org,
vincent.guittot@...aro.org, amit.kachhap@...il.com,
linux-kernel@...r.kernel.org, Zhang Rui <rui.zhang@...el.com>,
Javi Merino <javi.merino@...nel.org>,
"open list:THERMAL" <linux-pm@...r.kernel.org>,
daniel.thompson@...aro.org
Subject: Re: [PATCH 8/8] thermal/drivers/cpu_cooling: Add the combo cpu
cooling device
On 06-02-18, 11:48, Daniel Lezcano wrote:
> On 06/02/2018 05:28, Viresh Kumar wrote:
> > Surely we can do one thing at a time if that's the way we choose to do it.
>
> Easy to say :)
>
> The current code is to introduce the feature without impacting the DT
> bindings in order to keep focused on the thermal mitigation aspect.
>
> There are still a lot of improvements to do after that. You are
> basically asking me to implement the copy-on-write before the memory
> management is complete.
Perhaps I wasn't clear. What I was trying to say is that we can do "one thing at
a time" if we choose to create a "combo device" (the way you proposed). I am not
trying to force you to solve all the problems in one go :)
> Can you give an example? Or your understanding is incorrect or I missed
> the point.
So I tried to write it down and realized I was assuming that different
cooling-maps can be provided for different cooling strategies
(cpufreq/cpuidle) and obviously that's not the case as its per device.
Not sure if it would be correct to explore the possibility of doing
that.
--
viresh
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