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Date:   Wed, 7 Feb 2018 11:05:13 +0100
From:   Daniel Lezcano <daniel.lezcano@...aro.org>
To:     Viresh Kumar <viresh.kumar@...aro.org>
Cc:     edubezval@...il.com, kevin.wangtao@...aro.org, leo.yan@...aro.org,
        vincent.guittot@...aro.org, amit.kachhap@...il.com,
        linux-kernel@...r.kernel.org, Zhang Rui <rui.zhang@...el.com>,
        Javi Merino <javi.merino@...nel.org>,
        "open list:THERMAL" <linux-pm@...r.kernel.org>,
        daniel.thompson@...aro.org
Subject: Re: [PATCH 8/8] thermal/drivers/cpu_cooling: Add the combo cpu
 cooling device

On 07/02/2018 08:26, Viresh Kumar wrote:
> On 06-02-18, 11:48, Daniel Lezcano wrote:
>> On 06/02/2018 05:28, Viresh Kumar wrote:
> 
>>> Surely we can do one thing at a time if that's the way we choose to do it.
>>
>> Easy to say :)
>>
>> The current code is to introduce the feature without impacting the DT
>> bindings in order to keep focused on the thermal mitigation aspect.
>>
>> There are still a lot of improvements to do after that. You are
>> basically asking me to implement the copy-on-write before the memory
>> management is complete.
> 
> Perhaps I wasn't clear. What I was trying to say is that we can do "one thing at
> a time" if we choose to create a "combo device" (the way you proposed). I am not
> trying to force you to solve all the problems in one go :)

Oh, ok :)

>> Can you give an example? Or your understanding is incorrect or I missed
>> the point.
> 
> So I tried to write it down and realized I was assuming that different
> cooling-maps can be provided for different cooling strategies
> (cpufreq/cpuidle) and obviously that's not the case as its per device.
> Not sure if it would be correct to explore the possibility of doing
> that.
> 


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