[<prev] [next>] [<thread-prev] [thread-next>] [day] [month] [year] [list]
Message-ID: <20180208202136.rpghc2dpcd42zqvn@rob-hp-laptop>
Date: Thu, 8 Feb 2018 14:21:36 -0600
From: Rob Herring <robh@...nel.org>
To: Anson Huang <Anson.Huang@....com>
Cc: rui.zhang@...el.com, edubezval@...il.com, mark.rutland@....com,
shawnguo@...nel.org, kernel@...gutronix.de, fabio.estevam@....com,
linux@...linux.org.uk, linux-arm-kernel@...ts.infradead.org,
devicetree@...r.kernel.org, Linux-imx@....com,
linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org
Subject: Re: [PATCH V3 2/2] thermal: imx: add i.MX7 thermal sensor support
On Mon, Feb 05, 2018 at 04:12:27PM +0800, Anson Huang wrote:
> This patch adds i.MX7 thermal sensor support, most
> of the i.MX7 thermal sensor functions are same with
> i.MX6 except the registers offset/layout, so we move
> those registers offset/layout definitions to soc data
> structure.
>
> i.MX7 uses single calibration data @25C, the calibration
> data is located at OCOTP offset 0x4F0, bit[17:9], the
> formula is as below:
>
> Tmeas = (Nmeas - n1) + 25; n1 is the fuse value for 25C.
>
> Signed-off-by: Anson Huang <Anson.Huang@....com>
> Signed-off-by: Bai Ping <ping.bai@....com>
> ---
> changes since V2:
> Add bindind doc changes in this patch according to review comments.
> .../devicetree/bindings/thermal/imx-thermal.txt | 9 +-
Reviewed-by: Rob Herring <robh@...nel.org>
> drivers/thermal/imx_thermal.c | 314 ++++++++++++++++-----
> 2 files changed, 254 insertions(+), 69 deletions(-)
Powered by blists - more mailing lists