linux-kernel - Re: [GIT PULL V3] Thermal SoC management updates for v4.17-rc1

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Message-ID: <20180418141027.GA3303@localhost.localdomain>
Date:   Wed, 18 Apr 2018 07:10:30 -0700
From:   Eduardo Valentin <edubezval@...il.com>
To:     Zhang Rui <rui.zhang@...el.com>
Cc:     ACPI Devel Maling List <linux-acpi@...r.kernel.org>,
        Linux PM <linux-pm@...r.kernel.org>,
        LKML <linux-kernel@...r.kernel.org>
Subject: Re: [GIT PULL V3] Thermal SoC management updates for v4.17-rc1

Hello,

On Wed, Apr 18, 2018 at 03:51:29PM +0800, Zhang Rui wrote:
> Hi, Eduardo,
> 
> On 六, 2018-04-14 at 11:30 -0700, Eduardo Valentin wrote:
> > Hello Linus,
> > 
> > Please find thermal-soc changes for v4.17-rc1.
> > Rui asked me to send the pull request directly to you
> > as we are close to the end of the merge window.
> > Essentially this pull removes the series that caused
> > warning regression. I will work with the developer
> > to get that fixed later on, but I am still sending
> > the other few patches that are unrelated to that.
> > Let me know if this causes any issues and can still
> > be pulled.
> > 
> > Changelog:
> > - New i.MX7 thermal sensor
> > - Mediatek driver now supports MT7622 SoC
> > - Removal of min max cpu cooling DT property
> > 
> > Differences in V3:
> > - Rebased on top current linus/master, to avoid and merge issues
> > from previous pulled thermal code.
> > 
> > Differences in V2:
> > - Reordered the patches to drop exynos changes for now until we get
> > agreement on the fix on that driver for the compilation warns
> > caused by the confusing conversion functions.
> > 
> > 
> > The following changes since commit
> > 48023102b7078a6674516b1fe0d639669336049d:
> > 
> >   Merge branch 'overlayfs-linus' of
> > git://git.kernel.org/pub/scm/linux/kernel/git/mszeredi/vfs (2018-04-
> > 13 16:55:41 -0700)
> > 
> > are available in the git repository at:
> > 
> >   git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-
> > thermal linus
> > 
> > for you to fetch changes up to
> > 15a32df1918259be6c23fc36014fc26ee66c836c:
> > 
> >   dt-bindings: thermal: Remove "cooling-{min|max}-level" properties
> > (2018-04-14 09:37:55 -0700)
> > 
> This pull request does not catch this merge window.
> So do you want to split it into 2 separate pull requests, one for 4.17-
> rc and another for 4.18-rc1?

OK. Yeah, I am fine with that.

> 
> > ----------------------------------------------------------------
> > Anson Huang (1):
> >       thermal: imx: add i.MX7 thermal sensor support
> > 
> > Bartlomiej Zolnierkiewicz (1):
> >       dt-bindings: thermal: remove no longer needed samsung thermal
> > properties
> > 
> > Sean Wang (2):
> >       dt-bindings: thermal: add binding for MT7622 SoC
> >       thermal: mediatek: add support for MT7622 SoC
> > 
> > Viresh Kumar (1):
> >       dt-bindings: thermal: Remove "cooling-{min|max}-level"
> > properties
> > 
> IMO, together with the refreshed exynos fixes, the one from Viresh and
> the one from Bartlomiej can be queued for 4.17-rc, and the others have
> to wait until next merge window.
> 

Correct, the new chip support will need to wait for the next merge
window. I have already split the patches into the two categories.
The patches removing stuff are in my -fixes branch. All the other adding
new chip support are in my -linus branch.

Now, Do you have anything for this -rc2 ? If not, I will send directly
to Linus the stuff in my -fixes branch. Let me know.

Eduardo