linux-kernel - Re: [PATCH v2 4/5] thermal: tsens: Add support for SDM845

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Message-ID: <20180612192859.GA14933@rob-hp-laptop>
Date:   Tue, 12 Jun 2018 13:28:59 -0600
From:   Rob Herring <robh@...nel.org>
To:     Amit Kucheria <amit.kucheria@...aro.org>
Cc:     linux-kernel@...r.kernel.org, rnayak@...eaurora.org,
        linux-arm-msm@...r.kernel.org, bjorn.andersson@...aro.org,
        edubezval@...il.com, Zhang Rui <rui.zhang@...el.com>,
        Mark Rutland <mark.rutland@....com>,
        "open list:THERMAL" <linux-pm@...r.kernel.org>,
        "open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS" 
        <devicetree@...r.kernel.org>
Subject: Re: [PATCH v2 4/5] thermal: tsens: Add support for SDM845

On Tue, Jun 12, 2018 at 01:54:56PM +0300, Amit Kucheria wrote:
> SDM845 uses the TSENS v2 IP block
> 
> Signed-off-by: Amit Kucheria <amit.kucheria@...aro.org>
> ---
>  Documentation/devicetree/bindings/thermal/qcom-tsens.txt |  1 +

Acked-by: Rob Herring <robh@...nel.org>

>  drivers/thermal/qcom/Makefile                            |  2 +-
>  drivers/thermal/qcom/tsens-sdm845.c                      | 15 +++++++++++++++
>  drivers/thermal/qcom/tsens.c                             |  3 +++
>  drivers/thermal/qcom/tsens.h                             |  5 ++++-
>  5 files changed, 24 insertions(+), 2 deletions(-)
>  create mode 100644 drivers/thermal/qcom/tsens-sdm845.c