linux-kernel - [PATCH] dt-bindings: thermal: samsung: Add SPDX license identifier

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Message-Id: <20180718200250.6478-1-krzk@kernel.org>
Date:   Wed, 18 Jul 2018 22:02:50 +0200
From:   Krzysztof Kozlowski <krzk@...nel.org>
To:     Bartlomiej Zolnierkiewicz <b.zolnierkie@...sung.com>,
        Zhang Rui <rui.zhang@...el.com>,
        Eduardo Valentin <edubezval@...il.com>,
        linux-pm@...r.kernel.org, linux-samsung-soc@...r.kernel.org,
        linux-kernel@...r.kernel.org, Rob Herring <robh+dt@...nel.org>,
        Mark Rutland <mark.rutland@....com>,
        Kukjin Kim <kgene@...nel.org>,
        Krzysztof Kozlowski <krzk@...nel.org>,
        devicetree@...r.kernel.org, linux-arm-kernel@...ts.infradead.org
Subject: [PATCH] dt-bindings: thermal: samsung: Add SPDX license identifier

Replace GPL license statement with SPDX license identifier (GPL-2.0+).

Signed-off-by: Krzysztof Kozlowski <krzk@...nel.org>
---
 include/dt-bindings/thermal/thermal_exynos.h | 12 +-----------
 1 file changed, 1 insertion(+), 11 deletions(-)

diff --git a/include/dt-bindings/thermal/thermal_exynos.h b/include/dt-bindings/thermal/thermal_exynos.h
index 0646500bca69..642e4e7f4084 100644
--- a/include/dt-bindings/thermal/thermal_exynos.h
+++ b/include/dt-bindings/thermal/thermal_exynos.h
@@ -1,19 +1,9 @@
+/* SPDX-License-Identifier: GPL-2.0+ */
 /*
  * thermal_exynos.h - Samsung EXYNOS TMU device tree definitions
  *
  *  Copyright (C) 2014 Samsung Electronics
  *  Lukasz Majewski <l.majewski@...sung.com>
- *
- * This program is free software; you can redistribute it and/or modify
- * it under the terms of the GNU General Public License as published by
- * the Free Software Foundation; either version 2 of the License, or
- * (at your option) any later version.
- *
- * This program is distributed in the hope that it will be useful,
- * but WITHOUT ANY WARRANTY; without even the implied warranty of
- * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.  See the
- * GNU General Public License for more details.
- *
  */
 
 #ifndef _EXYNOS_THERMAL_TMU_DT_H
-- 
2.14.1