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Message-ID: <5B4F5D9B.8070008@hisilicon.com>
Date: Wed, 18 Jul 2018 16:32:43 +0100
From: Wei Xu <xuwei5@...ilicon.com>
To: Viresh Kumar <viresh.kumar@...aro.org>, <arm@...nel.org>,
Rob Herring <robh+dt@...nel.org>,
Mark Rutland <mark.rutland@....com>,
Catalin Marinas <catalin.marinas@....com>,
Will Deacon <will.deacon@....com>
CC: Vincent Guittot <vincent.guittot@...aro.org>,
<ionela.voinescu@....com>,
Daniel Lezcano <daniel.lezcano@...aro.org>,
<chris.redpath@....com>, <linux-arm-kernel@...ts.infradead.org>,
<devicetree@...r.kernel.org>, <linux-kernel@...r.kernel.org>
Subject: Re: [PATCH 3/6] arm64: dts: hisilicon: Add missing cooling device
properties for CPUs
Hi Viresh,
On 2018/5/25 6:40, Viresh Kumar wrote:
> The cooling device properties, like "#cooling-cells" and
> "dynamic-power-coefficient", should either be present for all the CPUs
> of a cluster or none. If these are present only for a subset of CPUs of
> a cluster then things will start falling apart as soon as the CPUs are
> brought online in a different order. For example, this will happen
> because the operating system looks for such properties in the CPU node
> it is trying to bring up, so that it can register a cooling device.
>
> Add such missing properties.
>
> Do minor rearrangement as well to keep ordering consistent.
>
> Signed-off-by: Viresh Kumar <viresh.kumar@...aro.org>
Thanks!
Applied to the hisilicon dt tree.
Best Regards,
Wei
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