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Message-ID: <5B4F5E00.5050800@hisilicon.com>
Date: Wed, 18 Jul 2018 16:34:24 +0100
From: Wei Xu <xuwei5@...ilicon.com>
To: Viresh Kumar <viresh.kumar@...aro.org>,
Zhang Rui <rui.zhang@...el.com>,
Eduardo Valentin <edubezval@...il.com>, <robh@...nel.org>
CC: <linux-pm@...r.kernel.org>,
Vincent Guittot <vincent.guittot@...aro.org>,
Daniel Lezcano <daniel.lezcano@...aro.org>,
<devicetree@...r.kernel.org>, <olof@...om.net>,
<linux-arm-kernel@...ts.infradead.org>,
<linux-kernel@...r.kernel.org>
Subject: Re: [PATCH 0/2] dt: thermal: Fix broken cooling-maps
Hi Viresh,
On 2018/7/5 6:09, Viresh Kumar wrote:
> Hi,
>
> This is an attempt to fix the broken or partially defined DT bindings
> for cooling-maps. We should list every device that participates in
> cooling down at a certain trip point, instead of just the first in the
> list as that depends on certain ordering of events to work properly.
>
> The first patch extends the binding to allow a list of phandles in
> "cooling-device" property and the second patch fixes one of the
> platform's DT.
>
> This will be followed up by fixing all platform DT bindings that have
> these issues after this set is accepted.
>
> The kernel also requires some changes to handle the phandle list, but
> wouldn't break with these changes as it reads the first phandle in the
> list for now. We can update that separately.
>
> --
> viresh
>
> Viresh Kumar (2):
> dt-bindings: thermal: Allow multiple devices to share cooling map
> arm64: dts: hi6220: Add all CPUs in cooling maps
>
> Documentation/devicetree/bindings/thermal/thermal.txt | 11 +++--------
> arch/arm64/boot/dts/hisilicon/hi6220.dtsi | 9 ++++++++-
> 2 files changed, 11 insertions(+), 9 deletions(-)
>
Thanks!
Applied both to the hisilicon dt tree.
Best Regards,
Wei
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