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Message-ID: <5B4F5E00.5050800@hisilicon.com>
Date:   Wed, 18 Jul 2018 16:34:24 +0100
From:   Wei Xu <xuwei5@...ilicon.com>
To:     Viresh Kumar <viresh.kumar@...aro.org>,
        Zhang Rui <rui.zhang@...el.com>,
        Eduardo Valentin <edubezval@...il.com>, <robh@...nel.org>
CC:     <linux-pm@...r.kernel.org>,
        Vincent Guittot <vincent.guittot@...aro.org>,
        Daniel Lezcano <daniel.lezcano@...aro.org>,
        <devicetree@...r.kernel.org>, <olof@...om.net>,
        <linux-arm-kernel@...ts.infradead.org>,
        <linux-kernel@...r.kernel.org>
Subject: Re: [PATCH 0/2] dt: thermal: Fix broken cooling-maps

Hi Viresh,

On 2018/7/5 6:09, Viresh Kumar wrote:
> Hi,
> 
> This is an attempt to fix the broken or partially defined DT bindings
> for cooling-maps. We should list every device that participates in
> cooling down at a certain trip point, instead of just the first in the
> list as that depends on certain ordering of events to work properly.
> 
> The first patch extends the binding to allow a list of phandles in
> "cooling-device" property and the second patch fixes one of the
> platform's DT.
> 
> This will be followed up by fixing all platform DT bindings that have
> these issues after this set is accepted.
> 
> The kernel also requires some changes to handle the phandle list, but
> wouldn't break with these changes as it reads the first phandle in the
> list for now. We can update that separately.
> 
> --
> viresh
> 
> Viresh Kumar (2):
>   dt-bindings: thermal: Allow multiple devices to share cooling map
>   arm64: dts: hi6220: Add all CPUs in cooling maps
> 
>  Documentation/devicetree/bindings/thermal/thermal.txt | 11 +++--------
>  arch/arm64/boot/dts/hisilicon/hi6220.dtsi             |  9 ++++++++-
>  2 files changed, 11 insertions(+), 9 deletions(-)
> 

Thanks!
Applied both to the hisilicon dt tree.

Best Regards,
Wei

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