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Date:   Fri, 31 Aug 2018 13:58:52 +0200
From:   Philipp Rossak <>
To:, Maxime Ripard <>
Subject: Re: [linux-sunxi] Re: [PATCH v3 21/30] iio: adc: sun4i-gpadc-iio: add
 support for H3 thermal sensor

On 31.08.2018 11:51, Icenowy Zheng wrote:
> Personally I suggest to leave out all SID or calibration related
> patches here.
> Currently we seems to be wrongly converting SID to big endian, however,
> the orgnization of the THS calibration data on H6 shows that it's
> surely little endian:
> It consists a temperature value in 1/10 celsuis as unit, and some
> thermal register readout values, which are the values read out at the
> given temperature, and every value here (the temperature and the
> readout) are all half word length.
> Let the temperature value be AABB, the two readout values be XXYY and
> ZZWW, the oragnization is:
> BB AA YY XX WW ZZ ** ** .
> When converting the SID to big endian, it becomes:
> XX YY AA BB ** ** ZZ WW ,
> which is non-sense, and not able to do sub-word cell addressing.
> Maxime, should I drop the LE2BE conversion in SID driver? (I doubt
> whether it will break compatibility.)
> Philipp, could you delay to send any code that uses SID?

Yes for sure! I will move the related patches to the end of the series 
and add a DO-NOT-MERGE flag in the title. So I can get those also 
ready/reviewed but not merged.

Icenowy, do you know more about the A83T SID? From the general specs it 
could be the same like on the A64 or the H3.


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