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Message-ID: <20180906115114.inc6dhqhy47obo25@flea>
Date: Thu, 6 Sep 2018 13:51:15 +0200
From: Maxime Ripard <maxime.ripard@...tlin.com>
To: Philipp Rossak <embed3d@...il.com>
Cc: Emmanuel Vadot <manu@...ouilliste.com>, lee.jones@...aro.org,
robh+dt@...nel.org, mark.rutland@....com, wens@...e.org,
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geert+renesas@...der.be, lukas@...ner.de, icenowy@...c.io,
arnd@...db.de, broonie@...nel.org, arnaud.pouliquen@...com,
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linux-arm-kernel@...ts.infradead.org
Subject: Re: [PATCH v3 27/30] ARM: dts: sun8i: h3: use calibration for ths
On Thu, Sep 06, 2018 at 01:47:47PM +0200, Philipp Rossak wrote:
> On 04.09.2018 18:46, Emmanuel Vadot wrote:
> > > + /* Data cells */
> > > + thermal_calibration: calib@234 {
> > > + reg = <0x234 0x8>;
> > > + };
> > You are declaring 8 bytes of calibration data but to my knowledge it's
> > only 2 bytes per sensor, so 2 bytes for H3.
> > Am I missing something ?
> >
> > Thanks,
>
> Emmanuel you are right, it is 2 bytes per Sensor and should be 2 bytes for
> H3, but the thermal calibration data field is on all chips 64 bit wide - so
> 8 bytes. So I'm reading here the complete calibration data field.
Having one cell per channel would make more sense I guess.
Maxime
--
Maxime Ripard, Bootlin
Embedded Linux and Kernel engineering
https://bootlin.com
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