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Message-ID: <20190327193110.GA11175@bogus>
Date:   Wed, 27 Mar 2019 14:31:10 -0500
From:   Rob Herring <robh@...nel.org>
To:     Manivannan Sadhasivam <manivannan.sadhasivam@...aro.org>
Cc:     xuwei5@...ilicon.com, robh+dt@...nel.org,
        linux-arm-kernel@...ts.infradead.org, devicetree@...r.kernel.org,
        linux-kernel@...r.kernel.org, john.stultz@...aro.org,
        amit.kucheria@...aro.org, guodong.xu@...aro.org,
        Manivannan Sadhasivam <manivannan.sadhasivam@...aro.org>
Subject: Re: [PATCH 1/3] dt-bindings: mmc: Add HI3670 MMC controller binding

On Thu, 28 Feb 2019 21:15:09 +0530, Manivannan Sadhasivam wrote:
> HI3670 SoC is architecturally same as the HI3660 SoC. Hence, the same
> K3 specific designware driver is reused for HI3670 SoC and the binding
> is documented with fallback approach for compatible property.
> 
> Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@...aro.org>
> ---
>  Documentation/devicetree/bindings/mmc/k3-dw-mshc.txt | 2 ++
>  1 file changed, 2 insertions(+)
> 

Reviewed-by: Rob Herring <robh@...nel.org>

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