linux-kernel - Re: [PATCH 0/14] v2 multi-die/package topology support

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Message-ID: <alpine.DEB.2.21.1904052031250.1802@nanos.tec.linutronix.de>
Date:   Fri, 5 Apr 2019 20:33:07 +0200 (CEST)
From:   Thomas Gleixner <tglx@...utronix.de>
To:     Len Brown <lenb@...nel.org>
cc:     x86@...nel.org, linux-kernel@...r.kernel.org
Subject: Re: [PATCH 0/14] v2 multi-die/package topology support

On Tue, 26 Feb 2019, Len Brown wrote:

> This patch series does 4 things.
> 
> 1. Parses the new CPUID.1F leaf to discover multi-die/package topology
> 
> 2. Export multi-die topology inside the kernel
> 
> 3. Update 3 places (coretemp, pkgtemp, rapl) that that need to know
>    the difference between die and package-scope MSR.
> 
>    (Note: Kan Liang has a patch series on top of this one to similarly
>    make the uncore perf code multi-die/package aware.)
> 
> 4. Export multi-die topology to user-space via sysfs

Aside of the few nitpicks (which apply to several patches) this looks very
nice.

Thanks,

	tglx