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Message-ID: <VI1PR04MB4333372C1DABD0E4C9DD7FE8F30C0@VI1PR04MB4333.eurprd04.prod.outlook.com>
Date: Fri, 10 May 2019 08:47:36 +0000
From: Andy Tang <andy.tang@....com>
To: Daniel Lezcano <daniel.lezcano@...aro.org>,
Shawn Guo <shawnguo@...nel.org>,
"viresh.kumar@...aro.org" <viresh.kumar@...aro.org>
CC: Leo Li <leoyang.li@....com>,
"robh+dt@...nel.org" <robh+dt@...nel.org>,
"mark.rutland@....com" <mark.rutland@....com>,
"linux-arm-kernel@...ts.infradead.org"
<linux-arm-kernel@...ts.infradead.org>,
"devicetree@...r.kernel.org" <devicetree@...r.kernel.org>,
"linux-kernel@...r.kernel.org" <linux-kernel@...r.kernel.org>,
"linux-pm@...r.kernel.org" <linux-pm@...r.kernel.org>,
"rui.zhang@...el.com" <rui.zhang@...el.com>,
"edubezval@...il.com" <edubezval@...il.com>
Subject: RE: [EXT] Re: [PATCH v6] arm64: dts: ls1088a: add one more thermal
zone node
+ Viresh for help.
> -----Original Message-----
> From: Daniel Lezcano <daniel.lezcano@...aro.org>
> Sent: 2019年5月10日 15:17
> To: Andy Tang <andy.tang@....com>; Shawn Guo <shawnguo@...nel.org>
> Cc: Leo Li <leoyang.li@....com>; robh+dt@...nel.org;
> mark.rutland@....com; linux-arm-kernel@...ts.infradead.org;
> devicetree@...r.kernel.org; linux-kernel@...r.kernel.org;
> linux-pm@...r.kernel.org; rui.zhang@...el.com; edubezval@...il.com
> Subject: Re: [EXT] Re: [PATCH v6] arm64: dts: ls1088a: add one more thermal
> zone node
>
> Caution: EXT Email
>
> On 10/05/2019 05:40, Andy Tang wrote:
> >> -----Original Message-----
> >> From: Shawn Guo <shawnguo@...nel.org>
> >> Sent: 2019年5月10日 11:14
> >> To: Andy Tang <andy.tang@....com>
> >> Cc: Leo Li <leoyang.li@....com>; robh+dt@...nel.org;
> >> mark.rutland@....com; linux-arm-kernel@...ts.infradead.org;
> >> devicetree@...r.kernel.org; linux-kernel@...r.kernel.org;
> >> linux-pm@...r.kernel.org; daniel.lezcano@...aro.org;
> >> rui.zhang@...el.com; edubezval@...il.com
> >> Subject: [EXT] Re: [PATCH v6] arm64: dts: ls1088a: add one more
> >> thermal zone node
> >>
> >> Caution: EXT Email
> >>
> >> On Tue, Apr 23, 2019 at 10:25:07AM +0800, Yuantian Tang wrote:
> >>> Ls1088a has 2 thermal sensors, core cluster and SoC platform. Core
> >>> cluster sensor is used to monitor the temperature of core and SoC
> >>> platform is for platform. The current dts only support the first sensor.
> >>> This patch adds the second sensor node to dts to enable it.
> >>>
> >>> Signed-off-by: Yuantian Tang <andy.tang@....com>
> >>> ---
> >>> v6:
> >>> - add cooling device map to cpu0-7 in platform node.
> > I like to explain a little. I think it makes sense that multiple thermal zone
> map to same cooling device.
> > In this way, no matter which thermal zone raises a temp alarm, it can call
> cooling device to chill out.
> > I also asked cpufreq maintainer about the cooling map issue, he think it
> would be fine.
> > I have tested and no issue found.
> >
> > Daniel, what's your thought?
>
> If there are multiple thermal zones, they will be managed by different
> instances of a thermal governor. Each instances will act on the shared cooling
> device and will collide in their decisions:
>
> - If the sensors are closed, their behavior will be similar regarding the
> temperature. The governors may take the same decision for the cooling
> device. But in such case having just one thermal zone managed is enough.
>
> - If the sensors are not closed, their behavior will be different regarding the
> temperature. The governors will take different decision regarding the cooling
> device (one will decrease the freq, other will increase the freq).
>
> As the thermal governors are not able to manage several thermal zones and
> there is one cooling device (the cpu cooling device), this setup won't work as
> expected IMO.
>
> The setup making sense is having a thermal zone per 'cluster' and a cooling
> device per 'cluster'. That means the platform has one clock line per 'cluster'.
> The thermal management happens in a self-contained thermal zone (one
> cooling device - one governor - one thermal zone).
>
> In the case of HMP, other combinations are possible to be optimal.
Hi Viresh,
I want to map multiple thermal zones to the same cooling device. The above is the discussion about it.
It seems reasonable. But I am not expert on this. Could you please provide some thoughts? Thanks.
BR,
Andy
>
>
>
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