linux-kernel - [tip:x86/topology] thermal/x86_pkg_temp

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Message-ID: <tip-724adec33c2491f26f739f285ddca25fca226e48@git.kernel.org>
Date:   Thu, 23 May 2019 02:27:38 -0700
From:   tip-bot for Zhang Rui <tipbot@...or.com>
To:     linux-tip-commits@...r.kernel.org
Cc:     len.brown@...el.com, linux-kernel@...r.kernel.org, hpa@...or.com,
        mingo@...nel.org, tglx@...utronix.de, rui.zhang@...el.com,
        peterz@...radead.org
Subject: [tip:x86/topology] thermal/x86_pkg_temp_thermal: Support
 multi-die/package

Commit-ID:  724adec33c2491f26f739f285ddca25fca226e48
Gitweb:     https://git.kernel.org/tip/724adec33c2491f26f739f285ddca25fca226e48
Author:     Zhang Rui <rui.zhang@...el.com>
AuthorDate: Mon, 13 May 2019 13:58:52 -0400
Committer:  Thomas Gleixner <tglx@...utronix.de>
CommitDate: Thu, 23 May 2019 10:08:33 +0200

thermal/x86_pkg_temp_thermal: Support multi-die/package

Package temperature sensors are actually implemented in hardware per-die.
Thus, the new multi-die/package systems sport mulitple package thermal
zones for each package.

Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose
multiple zones per package, instead of just one.

Signed-off-by: Zhang Rui <rui.zhang@...el.com>
Signed-off-by: Len Brown <len.brown@...el.com>
Signed-off-by: Thomas Gleixner <tglx@...utronix.de>
Reviewed-by: Ingo Molnar <mingo@...nel.org>
Acked-by: Peter Zijlstra (Intel) <peterz@...radead.org>
Link: https://lkml.kernel.org/r/281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com

---
 drivers/thermal/intel/x86_pkg_temp_thermal.c | 8 ++++----
 1 file changed, 4 insertions(+), 4 deletions(-)

diff --git a/drivers/thermal/intel/x86_pkg_temp_thermal.c b/drivers/thermal/intel/x86_pkg_temp_thermal.c
index 1ef937d799e4..405b3858900a 100644
--- a/drivers/thermal/intel/x86_pkg_temp_thermal.c
+++ b/drivers/thermal/intel/x86_pkg_temp_thermal.c
@@ -122,7 +122,7 @@ err_out:
  */
 static struct pkg_device *pkg_temp_thermal_get_dev(unsigned int cpu)
 {
-	int pkgid = topology_logical_package_id(cpu);
+	int pkgid = topology_logical_die_id(cpu);
 
 	if (pkgid >= 0 && pkgid < max_packages)
 		return packages[pkgid];
@@ -353,7 +353,7 @@ static int pkg_thermal_notify(u64 msr_val)
 
 static int pkg_temp_thermal_device_add(unsigned int cpu)
 {
-	int pkgid = topology_logical_package_id(cpu);
+	int pkgid = topology_logical_die_id(cpu);
 	u32 tj_max, eax, ebx, ecx, edx;
 	struct pkg_device *pkgdev;
 	int thres_count, err;
@@ -449,7 +449,7 @@ static int pkg_thermal_cpu_offline(unsigned int cpu)
 	 * worker will see the package anymore.
 	 */
 	if (lastcpu) {
-		packages[topology_logical_package_id(cpu)] = NULL;
+		packages[topology_logical_die_id(cpu)] = NULL;
 		/* After this point nothing touches the MSR anymore. */
 		wrmsr(MSR_IA32_PACKAGE_THERM_INTERRUPT,
 		      pkgdev->msr_pkg_therm_low, pkgdev->msr_pkg_therm_high);
@@ -515,7 +515,7 @@ static int __init pkg_temp_thermal_init(void)
 	if (!x86_match_cpu(pkg_temp_thermal_ids))
 		return -ENODEV;
 
-	max_packages = topology_max_packages();
+	max_packages = topology_max_packages() * topology_max_die_per_package();
 	packages = kcalloc(max_packages, sizeof(struct pkg_device *),
 			   GFP_KERNEL);
 	if (!packages)